Lecture 16b MEMS Packaging

Lecture 16b MEMS Packaging - Material Costs MEMS Packaging...

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1 October 11, 2001 MEMS Packaging Dr. Bruce K. Gale with assistance from Robert Giasolli Microsystems Principles ENGR 494C and 594C October 11, 2001 Microsystems Principles Material Costs October 11, 2001 Microsystems Principles What Does “Packaging” Mean • Connections from chip to outside world • Levels of packaging – L0: Features on chip –L1 : Ch ip –L2 : Ch ip carr ier –L3 : Card –L4 : Board – L5: Cables October 11, 2001 Microsystems Principles General Packaging • Packaging serves two main functions: – Protection of device from working environment – Protection of environment from device material and operation • Protection from environment – Electrical isolation or passivation from electrolytes and moisture – Mechanical protection to ensure structural integrity – Optical and thermal protection to prevent undesired effects on performance – Chemical isolation from harsh chemical environment • Protection from device – Material selection to eliminate or reduce host response – Device operation to avoid toxic products – Device sterilization October 11, 2001 Microsystems Principles Basic Package October 11, 2001 Microsystems Principles Packaging • One of least explored MEMS components
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2 October 11, 2001 Microsystems Principles Major Issues in MEMS Packaging • Literature is scarce – Proprietary processes • Up to and exceeding 75% of total cost • MEMS must often be in direct contact with environment • Often package must be designed specifically for device • Reliability • Media compatibility • Modularity • Small quantities • Release and stiction • Die handling and dicing •S t r e s s •O u t g a s s i n g •T e s t i n g • Encapsulation/ hermetic seals •I n t e g r a t i o n October 11, 2001 Microsystems Principles Basic Packaging Operations • Backside preparation • Die separation •D i e p i c
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This note was uploaded on 11/16/2011 for the course MSE 5960 taught by Professor Douglas during the Fall '04 term at University of Florida.

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Lecture 16b MEMS Packaging - Material Costs MEMS Packaging...

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