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Unformatted text preview: : •Low temperature < 450 C •Benign chemical environment •Benign radiation requirement System Integration Summary of steps •Circuit design and simulation •CMOS circuit fabrication at foundry •Co- and Post-IC MEMS fabrication •System packaging Micrograph of pressure sensor array MEMS pressure sensor array Electronics Hybrid or Modular Integration 3-D Packages 3-D Packages Folded Packaging Both passive and active components included in this hearing aid...
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This note was uploaded on 11/16/2011 for the course MSE 5960 taught by Professor Douglas during the Fall '04 term at University of Florida.
- Fall '04