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Unformatted text preview: : Low temperature < 450 C Benign chemical environment Benign radiation requirement System Integration Summary of steps Circuit design and simulation CMOS circuit fabrication at foundry Co- and Post-IC MEMS fabrication System packaging Micrograph of pressure sensor array MEMS pressure sensor array Electronics Hybrid or Modular Integration 3-D Packages 3-D Packages Folded Packaging Both passive and active components included in this hearing aid...
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- Fall '04