MCP9701-E TO-ND TempSensor

MCP9701-E TO-ND TempSensor - MCP9700/9700A MCP9701/9701A...

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Unformatted text preview: MCP9700/9700A MCP9701/9701A Low-Power Linear Active Thermistor™ ICs Features Description • Tiny Analog Temperature Sensor • Available Packages: - SC70-5, SOT-23-5, TO-92-3 • Wide Temperature Measurement Range: - -40°C to +125°C (Extended Temperature) - -40°C to +150°C (High Temperature) (MCP9700/9700A) • Accuracy: - ±2°C (max.), 0°C to +70°C (MCP9700A/9701A) - ±4°C (max.), 0°C to +70°C (MCP9700/9701) • Optimized for Analog-to-Digital Converters (ADCs): - 10.0 mV/°C (typical) MCP9700/9700A - 19.5 mV/°C (typical) MCP9701/9701A • Wide Operating Voltage Range: - VDD = 2.3V to 5.5V MCP9700/9700A - VDD = 3.1V to 5.5V MCP9701/9701A • Low Operating Current: 6 µA (typical) • Optimized to Drive Large Capacitive Loads The MCP9700/9700A and MCP9701/9701A family of Linear Active Thermistor™ Intergrated Circuit (IC) is an analog temperature sensor that converts temperature to analog voltage. It’s a low-cost, low-power sensor with an accuracy of ±2°C from 0°C to +70°C (MCP9700A/9701A) ±4°C from 0°C to +70°C (MCP9700/9701) while consuming 6 µA (typical) of operating current. Unlike resistive sensors (such as thermistors), the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. The voltage output pin (VOUT) can be directly connected to the ADC input of a microcontroller. The MCP9700/9700A and MCP9701/9701A temperature coefficients are scaled to provide a 1°C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. The MCP9700/9700A and MCP9701/9701A provide a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25°C, an accuracy of ±1°C (typical) can be realized from 0°C to +70°C. This accuracy can also be achieved by applying system calibration at +25°C. Typical Applications • • • • • • Hard Disk Drives and Other PC Peripherals Entertainment Systems Home Appliance Office Equipment Battery Packs and Portable Equipment General Purpose Temperature Monitoring In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability. Package Type 3-Pin TO-92 MCP9700/9701 Only 3-Pin SOT-23 MCP9700/9700A MCP9701/9701A GND 123 Bottom View 1 VDD VOUT GND © 2009 Microchip Technology Inc. 3 5-Pin SC70 MCP9700/9700A MCP9701/9701A NC 1 GND 2 VOUT 3 1 VDD 5 NC 4 VDD 2 VOUT DS21942E-page 1 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 2 © 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD:...................................................................... 6.0V Storage temperature: ........................ -65°C to +150°C Ambient Temp. with Power Applied:.. -40°C to +150°C Output Current ................................................. ±30 mA Junction Temperature (TJ): ................................ 150°C ESD Protection On All Pins (HBM:MM): ....(4 kV:200V) Latch-Up Current at Each Pin: ...................... ±200 mA †Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit VDD VDD 2.3 3.1 — — 5.5 5.5 V V Conditions Power Supply Operating Voltage Range Operating Current MCP9700/9700A MCP9701/9701A IDD — 6 12 µA Δ°C/ΔVDD — 0.1 — °C/V TACY — ±1 — °C TA = 0°C to +70°C TACY -2.0 ±1 +2.0 °C MCP9700A/9701A TA = -40°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9700A TA = -10°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9701A TA = 0°C to +70°C TACY -4.0 ±2 +4.0 °C MCP9700/9701 TA = -40°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9700 TA = -10°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9701 TA = -40°C to +150°C TACY -4.0 ±2 +6.0 °C High Temperature, MCP9700 only Power Supply Rejection Sensor Accuracy (Notes 1, 2) TA = +25°C Sensor Output Output Voltage, TA = 0°C V0°C — 500 — mV MCP9700/9700A Output Voltage, TA = 0°C V0°C — 400 — mV MCP9701/9701A Temperature Coefficient TC — 10.0 — mV/°C MCP9700/9700A — mV/°C MCP9701/9701A TC — 19.5 Output Non-linearity VONL — ±0.5 — °C Output Current IOUT — — 100 µA Output Impedance Output Load Regulation Turn-on Time Note 1: 2: 3: TA = 0°C to +70°C (Note 2) ZOUT — 20 — Ω IOUT = 100 µA, f = 500 Hz ΔVOUT/ ΔIOUT — 1 — Ω TA = 0°C to +70°C, IOUT = 100 µA tON — 800 — µs The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). © 2009 Microchip Technology Inc. DS21942E-page 3 MCP9700/9700A and MCP9701/9701A DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions CLOAD — — 1000 pF The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. SC-70 Thermal Response to 63% tRES — 1.3 — s TO-92 Thermal Response to 63% tRES — 1.65 — s Typical Load Capacitance Note 1: 2: 3: 30°C (Air) to +125°C (Fluid Bath) (Note 3) The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). M TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (Note 1) TA -40 — +125 °C MCP9700/9700A TA -10 — +125 °C MCP9701/9701A TA -40 — +150 °C High Temperature, MCP9700 only TA -40 — +125 °C Extended Temperature TA -40 — +150 °C High Temperature TA -65 — +150 °C Thermal Resistance, 5LD SC70 θJA — 331 — °C/W Thermal Resistance, 3LD SOT-23 θJA — 308 — °C/W Thermal Resistance, 3LD TO-92 θJA — 146 — °C/W Operating Temperature Range Storage Temperature Range Thermal Package Resistances Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). DS21942E-page 4 © 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 6.0 6.0 4.0 4.0 Accuracy (°C) Accuracy (°C) 5.0 MCP9701A VDD= 5.0V 3.0 2.0 Spec. Limits 1.0 0.0 MCP9700 VDD= 3.3V -4.0 -50 -25 0 25 50 75 TA (°C) 100 125 150 FIGURE 2-1: Accuracy vs. Ambient Temperature (MCP9700A/9701A). -50 MCP9701/ MCP9701A VDD= 5.5V VDD= 3.1V 2.0 0 25 50 75 TA (°C) 100 125 150 0.2 Δ A ccuracy Due to Load (°C) 4.0 -25 FIGURE 2-4: Accuracy vs. Ambient Temperature (MCP9700/9701). 6.0 MCP9700 MCP9700A VDD = 5.5V VDD = 2.3V Spec. Limits 0.0 MCP9700A VDD= 3.3V -2.0 Accuracy (°C) 2.0 -2.0 -1.0 ILOAD = 100 µA 0.1 0.0 MCP9701/MCP9701A VDD = 5.0V 0 MCP9700/MCP9700A VDD = 3.3V -0.1 -2.0 -0.2 -4.0 -50 -25 0 25 50 75 TA (°C) 100 125 -50 150 FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. Load Regulation ΔV/ΔI (Ω) 4.0 10.0 MCP9701 MCP9701A 8.0 6.0 MCP9700/MCP9700A 4.0 2.0 0.0 -50 -25 FIGURE 2-3: Temperature. 0 25 50 75 TA (°C) 100 125 Supply Current vs. © 2009 Microchip Technology Inc. -25 0 25 50 75 TA (°C) 100 125 150 FIGURE 2-5: Changes in Accuracy vs. Ambient Temperature (Due to Load). 12.0 IDD (µA) MCP9701 VDD= 5.0V 150 3.0 MCP9700/MCP9700A MCP9701/MCP9701A VDD = 3.3V 2.0 IOUT = 50 µA IOUT = 100 µA IOUT = 200 µA 1.0 0.0 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-6: Load Regulation vs. Ambient Temperature. DS21942E-page 5 MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 35% 35% VDD = 3.3V 108 samples MCP9700A 30% 25% Occurrences 20% 15% MCP9700 10% 25% MCP9701 VDD = 5.0V 108 samples 20% MCP9701A 15% 10% V0°C (mV) Normalized PSRR (°C/V) Normalized PSRR (°C/V) 0.15 0.05 MCP9700/MCP9700A VDD= 2.3V to 4.0V 0.00 -50 -25 0 25 50 75 TA (°C) 100 125 150 FIGURE 2-9: Power Supply Rejection (Δ°C/ΔVDD) vs. Ambient Temperature. DS21942E-page 6 500 480 460 440 20.0 19.9 19.8 19.7 19.7 FIGURE 2-11: Occurrences vs. Temperature Coefficient (MCP9701/9701A). 0.30 MCP9700/MCP9700A VDD= 2.3V to 5.5V 0.20 0.10 19.6 TC (mV/°C) FIGURE 2-8: Occurrences vs. Temperature Coefficient (MCP9700/9700A). 0.25 19.5 19.4 19.3 MCP9701 MCP9701A VDD = 5.0V 108 samples 19.2 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% 19.3 Occurrences 10.5 10.4 10.3 10.2 10.2 10.1 9.9 10.0 9.8 9.8 MCP9700 MCP9700A VDD = 3.3V 108 samples 9.7 Occurrences FIGURE 2-10: Output Voltage at 0°C (MCP9701/9701A). TC (mV/°C) 0.30 420 V0°C (mV) FIGURE 2-7: Output Voltage at 0°C (MCP9700/9700A). 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% 400 380 360 340 300 600 580 560 540 520 500 480 460 440 0% 420 0% MCP9701 5% 400 5% 320 Occurrences 30% 0.25 MCP9701/MCP9701A MCP9701/MCP9701A VDD= 3.1V to 5.5V 3.1V to 5.5V 0.20 0.15 0.10 0.05 MCP9701/MCP9701A MCP9701/MCP9701A VDD= 3.1V to 4.0V 3.1V to 4.0V 0.00 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-12: Power Supply Rejection (Δ°C/ΔVDD) vs. Temperature. © 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 1.6 3.0 TA = +26°C 1.4 2.5 1.0 VOUT (V) 0.8 0.6 0.4 MCP9701 MCP9701A 2.0 1.5 1.0 MCP9700 MCP9700A 0.5 0.2 0.0 0.0 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -25 Output Voltage vs. Power 2.5 VDD_STEP = 5V TA = 26°C 10 1.7 IDD 0.8 3.0 Output vs. Settling Time to TA (°C) VOUT 1.0 80 Leaded, without PCB SC70-5 SOT-23-3 TO-92-3 30 4 6 8 10 12 14 16 18 Time (s) FIGURE 2-15: Fluid Bath). Thermal Response (Air to © 2009 Microchip Technology Inc. 30.0 18.0 -18.0 0.5 -30.0 -42.0 FIGURE 2-17: Ramp VDD. Output Impedance (Ω) SC70-5 1 in. x 1 in. Copper Clad PCB 2 VDD_RAMP = 5V/ms TA = +26°C -6.0 1000 0 Output Voltage vs. Ambient 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) 130 -2 125 6.0 Time (ms) 55 100 0.0 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -2.5 0.0 0 -0.1 -1.7 105 75 1.5 -0.8 2 FIGURE 2-14: step VDD. 50 2.0 0.0 VOUT 4 IDD 2.5 V OUT (V) 6 VOUT (V) FIGURE 2-16: Temperature. IDD (mA) 12 8 25 TA (°C) VDD (V) FIGURE 2-13: Supply. 0 IDD (µA) V OUT (V) 1.2 Output vs. Settling Time to VDD = 5.0V IOUT = 100 µA TA = +26°C 100 10 1 0. 0.1 1 1 FIGURE 2-18: Frequency. 100 1k 10 10 100 1000 Frequency (Hz) 10k 100k 10000 100000 Output Impedance vs. DS21942E-page 7 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 8 © 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. SC70 Pin No. SOT-23 Pin No. TO-92 Symbol 1 — — NC 2 3 3 GND Power Ground Pin 3 2 2 VOUT Output Voltage Pin 4 1 1 VDD Power Supply Input 5 — — NC No Connect (this pin is not connected to the die). 3.1 Power Ground Pin (GND) GND is the system ground pin. 3.2 Output Voltage Pin (VOUT) The sensor output can be measured at VOUT. The voltage range over the operating temperature range for the MCP9700/9700A is 100 mV to 1.75V and for the MCP9701/9701A, 200 mV to 3V . © 2009 Microchip Technology Inc. Function No Connect (this pin is not connected to the die). 3.3 Power Supply Input (VDD) The operating voltage as specified in the “DC Electrical Characteristics” table is applied to VDD. 3.4 No Connect Pin (NC) This pin is not connected to the die. It can be used to improve thermal conduction to the package by connecting it to a Printed Circuit Board (PCB) trace from the thermal source. DS21942E-page 9 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 10 © 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A APPLICATIONS INFORMATION The Linear Active Thermistor™ IC uses an internal diode to measure temperature. The diode electrical characteristics have a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 150°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typical) for the MCP9700/9700A and 19.5 mV/°C (typical) for the MCP9701/9701A. The output voltage at 0°C is also scaled to 500 mV (typical) and 400 mV (typical) for the MCP9700/9700A and MCP9701/9701A, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1 and Figure 2-16. EQUATION 4-1: SENSOR TRANSFER FUNCTION V OUT = T C • T A + V 0 ° C Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0°C = Sensor Output Voltage at 0°C (See DC Electrical Characteristics table) TC = Temperature Coefficient (See DC Electrical Characteristics table) 3.0 2.0 Accuracy (°C) 4.0 1.0 0.0 -1.0 VDD= 3.3V 10 Samples -2.0 -3.0 -50 -25 0 FIGURE 4-2: vs. Temperature. 25 50 TA (°C) 75 100 125 Relative Accuracy to +25°C The change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output non-linearity. For higher accuracy using a sensor compensation technique, refer to AN1001 “IC Temperature Sensor Accuracy Compensation with a PICmicro® Microcontroller” (DS01001). The application note shows that if the MCP9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to ±0.5°C (typical) accuracy over the operating temperature (Figure 4-3). 6.0 MCP9700 100 Samples VDD VOUT ANI PICmicro® MCU GND 4.0 Accuracy (°C) VDD Spec. Limits 2.0 0.0 +s Average -s -2.0 -4.0 VSS VSS -50 -25 0 25 50 75 100 125 Temperature (°C) FIGURE 4-1: 4.1 Typical Application Circuit. Improving Accuracy The MCP9700/9700A and MCP9701/9701A accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at +25°C ambient improves the measurement accuracy to a ±0.5°C (typical) from 0°C to +70°C, as shown in Figure 4-2. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. © 2009 Microchip Technology Inc. FIGURE 4-3: Sensor Accuracy. MCP9700/9700A Calibrated The compensation technique provides a linear temperature reading. A firmware look-up table can be generated to compensate for the sensor error. DS21942E-page 11 MCP9700/9700A and MCP9701/9701A 4.2 Shutdown Using Microcontroller I/O Pin The MCP9700/9700A and MCP9701/9701A family of low operating current of 6 µA (typical) makes it ideal for battery-powered applications. However, for applications that require tighter current budget, this device can be powered using a microcontroller Input/ Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/9700A and MCP9701/9701A as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 Layout Considerations The MCP9700/9700A and MCP9701/9701A family does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200Ω resistor with a 1 µF decoupling capacitor. A high frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor. 4.4 Thermal Considerations The MCP9700/9700A and MCP9701/9701A family measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, consider using the TO-92 package. The MCP9700/9700A and MCP9701/9701A is designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 4-2. EQUATION 4-2: EFFECT OF SELFHEATING T J – T A = θ JA ( V DD I DD + ( V DD – V OUT ) I OUT ) Where: TJ = Junction Temperature TA = Ambient Temperature θJA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage At TA = +25°C (VOUT = 0.75V) and maximum specification of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA, the self-heating due to power dissipation (TJ – TA) is 0.179°C. DS21942E-page 12 © 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 3-Lead SOT-23 XXNN Example: Device Code MCP9700T AENN MCP9700AT AFNN MCP9701T AMNN MCP9701AT AE25 APNN Note: Applies to 3-Lead SOT-23 3-Lead TO-92 Example: XXXXXX XXXXXX XXXXXX YWWNNN MCP 9700E e3 TO^^ 916256 5-Lead SC70 XXNN Example: Device Code MCP9700T AUNN MCP9700AT AXNN MCP9701T AVNN MCP9701AT AU25 AYNN Note: Applies to 5-Lead SC70. Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2009 Microchip Technology Inc. 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MCP9700/9700A and MCP9701/9701A /HDG 3ODVWLF 7UDQVLVWRU 2XWOLQH 72 >72 1RWH @ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ E A N 1 L 12 3 b e c D R 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI 3LQV ,1&+(6 0,1 0$; 1 3LWFK H %RWWRP WR 3DFNDJH )ODW ' 2YHUDOO :LGWK ( 2YHUDOO /HQJWK $ 0ROGHG 3DFNDJH 5DGLXV 5 7LS WR 6HDWLQJ 3ODQH / /HDG 7KLFNQHVV %6& F ± /HDG :LGWK E 1RWHV 'LPHQVLRQV $ DQG ( GR QRW LQFOXGH PROG IODVK RU SURWUXVLRQV 0ROG IODVK RU SURWUXVLRQV VKDOO QRW H[FHHG 'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( < 0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV SHU VLGH 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ & © 2009 Microchip Technology Inc. % DS21942E-page 17 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 18 © 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A APPENDIX A: REVISION HISTORY Revision E (April 2009) The following is the list of modifications: 1. 2. 3. 4. Added High Temperature option throughout document. Updated plots to reflect the high temperature performance. Updated Package Outline drawings. Updated Revision history. Revision D (October 2007) The following is the list of modifications: 1. 2. 3. Added the 3-lead SOT-23 devices to data sheet. Replaced Figure 2-15. Updated Package Outline Drawings. Revision C (June 2006) The following is the list of modifications: 1. 2. Added the MCP9700A and MCP9701A devices to data sheet. Added TO92 package for the MCP9700/ MCP9701. Revision B (October 2005) The following is the list of modifications: 1. 2. 3. 4. 5. Added Section 3.0 “Pin Descriptions”. Added the Linear Active Thermistor™ IC trademark. Removed the 2nd order temperature equation and the temperature coeficient histogram. Added a reference to AN1001 and corresponding verbiage. Added Figure 4-2 and corresponding verbiage. Revision A (November 2005) • Original Release of this Document. © 2009 Microchip Technology Inc. DS21942E-page 19 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 20 © 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. – X /XX Temperature Range Package Examples: MCP9700T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9700AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free Temperature Range: E H Package: = = LT = TO = TT = -40°C to +125°C -40°C to +150°C (MCP9700 only) Plastic Small Outline Transistor, 5-lead Plastic Small Outline Transistor, 3-lead Plastic Small Outline Transistor, 3-lead MCP9700T-E/LT: MCP9700-E/TO: c) MCP9700T-E/TO: d) MCP9700T-H/LT: a) Device: a) b) Device MCP9700AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. MCP9700AT-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. b) Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. Linear Active Thermistor™ IC, 3LD TO-92 package. Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. Linear Active Thermistor™ IC, Tape and Reel, High Temperature, 5LD SC70 package. a) MCP9701T-E/LT: b) MCP9701-E/TO: c) MCP9701T-E/TO: a) MCP9701AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. MCP9701AT-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. b) © 2009 Microchip Technology Inc. Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. Linear Active Thermistor™ IC, 3LD TO-92 package. Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. DS21942E-page 21 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 22 © 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2009 Microchip Technology Inc. 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This note was uploaded on 11/21/2011 for the course ECE 3411 taught by Professor Park during the Fall '11 term at UConn.

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