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Hmwk_3+08 - Materials Science and Engineering 206(196...

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Materials Science and Engineering 206 (196) Prof. W.D. Nix Imperfections in Crystalline Solids Spring 2008 Homework Assignment #3 (due: April 24, 2008) 1. The maximum solubility of Sn in solid aluminum is 0.1 atomic percent (x = 10 -3 ) and this occurs at 600 ˚ C. This solubility limit is dominated by the formation enthalpy of Sn solute atoms in aluminum. Calculate the formation enthalpy of the solute defect and estimate the solubility (i.e. equilibrium concentration) of Sn in aluminum at room temperature. 2. In an integrated circuit, aluminum conductors are in contact with and may be in equilibrium with essentially pure silicon. They are also covered with a very rigid material such as silicon nitride. The diagram below shows a schematic of the structure. During processing, residual stresses can be built up in such thin films as a result of differences in thermal expansion. It is not uncommon for such films to be subjected to hydrostatic tension in these instances. For the present problem we
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