hw3 - 1.033/1.57 H#3 Elasticity& Elasticity Bounds Due...

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Unformatted text preview: 1.033/1.57 H#3: Elasticity & Elasticity Bounds Due: November 5, 2003 MIT — 1.033/1.57 Fall 2003 Instructor: Franz-Josef ULM Elasticity Bounds of Microflexural Structures (MEMS TYPE) Microelectromechan- ical systems (MEMS) are miniature electromechanical sensor and actuator that are used as ac- celerometers, micro-pumps, micro-turbines, and optical switches. The majority of MEMS devices are based on the movement of cantilever beams or thin membranes. MEMS are often made of thin layers of polysilicon, amorphous silicon, silica, oxides or polyimides, and the material is deposited in layers on some substratum (see figure (a) below). We want to give a lower bound and an upper bound for the apparent elasticity modulus of such microflexural structures. To this end, we consider a cantilever beam of length L along the x − axis and of height h and width b , as shown in figure (b) below. At x = 0 , the section (centered around O ) is in contact without friction with a fixed rigid plate. At the...
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hw3 - 1.033/1.57 H#3 Elasticity& Elasticity Bounds Due...

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