lab10_micro updated 2008 fall

lab10_micro updated 2008 fall - ME 363 LAB #10: SOFT...

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ME 363 LAB #10: SOFT LITHOGRAPHY PART II Photoresist coating and pattern development Meet in MMC, ME32 Purpose : To be trained for using soft lithography facilities, including spin coater, mask aligner, and hotplate. Use mask made in previous lab (lab#9) to microfabricate the pattern onto the photoresist and PDMS. Instruments : 144 sq. ft. class 10,000 clean room (in ME32), Class 10 solvent hood,Suss MA1006 mask aligner, Delta-10 spin coaters, Hot plate and convection oven Material s : Su-8 2025 photoresist, 4” Round silicon (glass) wafer, PDMS elastomer, Su-8 photoresist developing chemicals, Falcon wafer container. Dress code: long pants, closed-toe shoes , no wrist watches or hand jewelry. Procedures : 1. MMC Lab Safety Walk-thru: You must have already read ALL of the material for new users at MMC website ( https://engineering.purdue.edu/MMC/ Click general certification under User Info) before participating in this walk-thru. 2.
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lab10_micro updated 2008 fall - ME 363 LAB #10: SOFT...

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