BPV23FConstruction

BPV23FConstruction - Devices in metal packages are...

Info iconThis preview shows page 1. Sign up to view the full content.

View Full Document Right Arrow Icon
Component Construction Component Construction Vishay Semiconductors www.vishay.com For technical questions concerning emitters, contact: emittertechsupport@vishay.com Document Number: 80081 1 For technical questions concerning detectors, contact: detectortechsupport@vishay.com Rev. 1.3, 06-Jun-08 Photodetector and infrared emitter components are available in plastic or metal packages. Plastic devices mostly include a lens to improve radiant sensitivity or radiant intensity. Detector chips are mounted on flat leadframe surfaces while leadframes for emitters have a silver plated reflector performing higher radiant intensity.
Background image of page 1
This is the end of the preview. Sign up to access the rest of the document.

Unformatted text preview: Devices in metal packages are hermetically sealed, are released for extended operating temperature range and have small optical and mechanical tolerances. Plastic package IRED chip Reflector Anode Cathode AU-b ond w ire Lead frame 94 8 314 96 11621-1 Chip Bond w ire Reflector cone filled w ith epoxy Leadframe Polarity identification White plastic case Cathode Anode Black plastic package daylight b locking filter PI N diode chip Collimating lens 94 8 165 Cathode Anode PI N diode chip Metal can package Glass w indo w 94 8 315...
View Full Document

Ask a homework question - tutors are online