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Unformatted text preview: very closely along the cable. 4. TI introduced a new series of high speed TTL circuits in standard packaging using identical cir-cuit dice as their older series which they claimed had significantly better noise performance. As-suming they made no electrical changes to the chip or 16-pin dip packaging (i.e. same die and physical package) -- how could they make this (True!) claim? 5. Consider a new chip you have built with output pad drivers that switch in 500pS. If these chips are placed on an (epoxy) circuit board using PGA packages, what is the maximum length of a wire w/o termination in the circuit board? If the board has a ground plane? (Use the default figures in the notes for parameters). For a 2.5V signaling swing, what level of voltage noise is created by the intrinsic inductance of the package?...
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This note was uploaded on 12/28/2011 for the course ECE 124d taught by Professor Staff during the Fall '08 term at UCSB.
- Fall '08