microvia

microvia - REQUIREMENTS TO MICROVIA Clean vias without...

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A PRESENTATION ON MICROVIA TECHNOLOGY www.powerpointpresentationon.blogspot.com
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CONTENTS: 1. Introduction 2. Need 3. Requirements to Microvias 4. Microvia formation 5. Microvia filling technology 6. Future applications
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INTRODUCTION Small holes Blind vias
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NEED OF MICROVIA The development of very complex ICs with extremely high input output has forced the electronic manufacturer to develop new packaging and assembly techniques. Components with pitches less than 0.30mm,chip scale packages and flip chip tech are underlining this trend and highlight importance of new PCBs
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Unformatted text preview: REQUIREMENTS TO MICROVIA Clean vias without residue. No delamination of copper and substrate. Big land diameter for robust interconnection to the inner layer. MICROVIA FORMATION FORMATION METHODS: Mechanically drilled vias. Etching. Plasma etching. Laser drilling. COMPARISION The following graph shows the dynamic range in hole sizes that different methods offer: FUTURE APPLICATIONS: In Automobile industries. Intelligent devices and systems. Mobiles phones. Also expected in Computers...
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microvia - REQUIREMENTS TO MICROVIA Clean vias without...

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