Thermodynamics HW Solutions 197

Thermodynamics HW Solutions 197 - cylindrical copper...

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Chapter 15 Steady Heat Conduction h o [W/m 2 .C] Q total [W] 5 55515 10 72095 15 80100 20 84817 25 87927 30 90132 35 91776 40 93050 45 94065 50 94894 0.08 0.12 0.16 0.2 0.24 0.28 0.32 60000 80000 100000 120000 140000 160000 L wall [m] Q total [W] 5 10 15 20 25 30 35 40 45 50 55000 60000 65000 70000 75000 80000 85000 90000 95000 h o [W/m 2 -C] 3-63E The thermal resistance of an epoxy glass laminate across its thickness is to be reduced by planting
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Unformatted text preview: cylindrical copper fillings throughout. The thermal resistance of the epoxy board for heat conduction across its thickness as a result of this modification is to be determined. 3-40...
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This note was uploaded on 01/14/2012 for the course PHY 4803 taught by Professor Dr.danielarenas during the Fall '10 term at UNF.

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