Thermodynamics HW Solutions 198

Thermodynamics HW Solutions 198 - 6 ( = = = = = = = = = =...

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Chapter 15 Steady Heat Conduction Assumptions 1 Steady operating conditions exist. 2 Heat transfer through the plate is one-dimensional. 3 Thermal conductivities are constant. Properties The thermal conductivities are given to be k = 0.10 Btu/h ft °F for epoxy glass laminate and k = 223 Btu/h ft °F for copper fillings. Analysis The thermal resistances of copper fillings and the epoxy board are in parallel. The number of copper fillings in the board and the area they comprise are 2 2 2 2 2 2 ft 3042 . 0 0291 . 0 3333 . 0 ft 0291 . 0 4 ft) 12 / 02 . 0 ( 333 , 13 4 fillings) copper of (number 333 , 13 ft) 12 / 06 . 0 ( ft) 12 / 06 . 0 ( ft 33 . 0 m 333 . 0 ft) 12 / 8 ( ft) 12 /
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Unformatted text preview: 6 ( = = = = = = = = = = copper total epoxy copper copper total A A A D n A n A R copper R epoxy The thermal resistances are evaluated to be F/Btu h. 137 . ) ft 3042 . ( F) Btu/h.ft. 10 . ( ft 12 / 05 . F/Btu h. 00064 . ) ft 0291 . ( F) Btu/h.ft. 223 ( ft 12 / 05 . 2 2 = = = = = = kA L R kA L R epoxy copper Then the thermal resistance of the entire epoxy board becomes F/Btu h. 0.00064 = + = + = board epoxy copper board R R R R 137 . 1 00064 . 1 1 1 1 3-41...
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This note was uploaded on 01/14/2012 for the course PHY 4803 taught by Professor Dr.danielarenas during the Fall '10 term at UNF.

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