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ECE_220A_Lecture-15_Nov_10_2011_slides

ECE_220A_Lecture-15_Nov_10_2011_slides - Chemical...

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Figure 11.8 Chemical mechanical polishing of the surface of a partially processed wafer done to achieve a high degree of global planarization. Fabrication Engineering at the Micro- and Nanoscale Campbell Copyright © 2009 by Oxford University Press, Inc. Chemical Mechanical Polishing (CMP) Very good for planarization Key components - Slurry Polishing Pad (proprietary) typically etching multicomponents Application: Planarization of interconnect metallization, dielectrics
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Fabrication Engineering at the Micro- and Nanoscale Campbell Copyright © 2009 by Oxford University Press, Inc. Example of CMP
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Back to etching features
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Figure 11.1 Typical isotropic etch process showing the etch bias. Fabrication Engineering at the Micro- and Nanoscale Campbell Copyright © 2009 by Oxford University Press, Inc. Would like anisotropic etching - how do you get it?
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Dry Processing or Plasma Processing Plasma Reactive Ion Etching (RIE) Ion Milling Why use dry processing? What does a plasma do?
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Reactive Ion Etching: parallel plate reactor
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Talk about how plasma forms
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What is a plasma? Ions electrons excited ions excited neutral atoms Parameters to control: rf-Power Bias-Voltage Current Pressure Temperature Gas composition
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Physical Etch Ions, electrons, photons anisotropy control insensitivity to surface, crystal orientation Chemical Etch Reactive gas • materials selectivity
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