Thermodynamics HW Solutions 267

Thermodynamics HW Solutions 267 - Chapter 3 Steady Heat...

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Chapter 3 Steady Heat Conduction 3-157 A multilayer circuit board dissipating 27 W of heat consists of 4 layers of copper and 3 layers of epoxy glass sandwiched together. The circuit board is attached to a heat sink from both ends maintained at 35 ° C. The magnitude and location of the maximum temperature that occurs in the board is to be determined. Assumptions 1 Steady operating conditions exist. 2 Heat transfer can be approximated as being one- dimensional. 3 Thermal conductivities are constant. 4 Heat is generated uniformly in the epoxy layers of the board. 5 Heat transfer from the top and bottom surfaces of the board is negligible. 6 The thermal contact resistances at the copper-epoxy interfaces are negligible. Properties The thermal conductivities are given to be k = 386 W/m °C for copper layers and
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This note was uploaded on 01/19/2012 for the course PHY 4803 taught by Professor Dr.danielarenas during the Fall '10 term at UNF.

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