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Thermodynamics HW Solutions 274

Thermodynamics HW Solutions 274 - Chapter 3 Steady Heat...

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Chapter 3 Steady Heat Conduction 3-164 A circuit board houses electronic components on one side, dissipating a total of 15 W through the backside of the board to the surrounding medium. The temperatures on the two sides of the circuit board are to be determined for the cases of no fins and 20 aluminum fins of rectangular profile on the backside. Assumptions 1 Steady operating conditions exist. 2 The temperature in the board and along the fins varies in one direction only (normal to the board). 3 All the heat generated in the chips is conducted across the circuit board, and is dissipated from the backside of the board. 4 Heat transfer from the fin tips is negligible. 5 The heat transfer coefficient is constant and uniform over the entire fin surface. 6 The thermal properties of the fins are constant. 7 The heat transfer coefficient accounts for the effect of radiation from the fins. Properties The thermal conductivities are given to be k = 12 W/m °C for the circuit board, k = 237 W/m °C
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