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EE 330 HW 1 Spring 2012

# EE 330 HW 1 Spring 2012 - EE 330 Homework 1 Spring 2012 Due...

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EE 330 Homework 1 Spring 2012 Due Friday Jan 13 Problem 1 Assume a simple circuit requires 10,000 MOS transistors on a die and that all transistors are minimum sized. If the transistors are fabricated in a 32nm CMOS process and the spacing overhead for the transistors is a factor of 10, determine the number of die that can be fabricated on an 12” silicon wafer. Neglect the area required for the bonding pads of the circuit. Problem 2 If the cost of a 12 inch wafer is \$6000, what is the cost/die for the circuit in Problem 1. Problem 3 How many 20 nm transistors could be placed on a die that has the same area as the cross-section of a human hair? Assume a 10x spacing overhead. Problem 4 The clock frequency of microprocessors has not increased appreciably for the past several years yet performance is improving through the parallelism offered by multiple cores. Why is it more energy efficient to use multiple cores on a die each operating at a lower clock rate than to have a single core operating at a higher clock frequency?

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