EE 330 Lab 5 Spring 2011

EE 330 Lab 5 Spring - EE 330 Laboratory 5 Creating bonding pads Spring 2011 Objective The objective of this experiment is investigate the design of

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EE 330 Laboratory 5 Creating bonding pads Spring 2011 Objective: The objective of this experiment is investigate the design of a basic bonding pad and simple ESD protection circuitry. Part 1: Layout of a resistor The first step of this lab is to learn how to create a resistor. A resistor can be created using almost any layer available in the process. For example, to create a resistor using poly, draw a poly with terminals at its ends as shown below (poly is red, metal1 is blue, and cyan is res_id). For correct extraction of these “intended” resistors, you need to cover the poly with the identification layer called res_id. From its name, we can deduce that this is an identification layer, not an actual physical layer for fabrication. The number of squares of poly covered by the res_id layer are used to calculate the value of the resistance. The res_id layer must be used to create resistors in all possible except for the high_res layer. The high_res (high resistance) layer, in contrast with res_id, is a physical layer i.e., sent to foundry but does not correspond to actual physical shape. When used with the poly2(elec for our environment) layer, the high_res layer results in increased resistance of poly2 (elec) layer. If you intend to use the high_res layer, follow the design rules on MOSIS website (see section 27). The following table provides the sheet resistance of all the layers that can be used to create resistors for the AMI 0.5u process. Layer Sheet resistance per square nwell 819 poly 25 elec (poly2) 26 metal1 0.090000 metal3 0.050000 metal2 0.090000 highres 1192
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You are to create a resistor of value approximately 5 KΩ (+/- 20 Ω) while minimizing the area of the resistor, without using highres. Extract the resistor to see its calculated value. You can ignore the resistance of the contacts for the purpose of this lab. Show this resistor (and its value) to your TA. Part 2: Introduction to bonding pads
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EE 330 Lab 5 Spring - EE 330 Laboratory 5 Creating bonding pads Spring 2011 Objective The objective of this experiment is investigate the design of

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