EE 330 Lect 3 Spring 2011

# EE 330 Lect 3 Spring 2011 - EE 330 Lecture 3 Basic Concepts...

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EE 330 Lecture 3 Basic Concepts Historical Background, Feature Sizes and Yield

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Quiz 2 How many minimum-sized MOS transistors can be placed on a square die that is 1000μ on a side in a 65nm process? (Neglect any bonding pads needed to get the signals to the outside world. Assume factor of 10 overhead for spacing between transistors). 1000μ
And the number is …. 6 3 1 2 4 5 7 8 9

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And the number is …. 6 3 1 2 4 5 7 8 9 9
Quiz 2 How many minimum-sized MOS transistors can be placed on a square die that is 1000μ on a side in a 65nm process? (Neglect any bonding pads needed to get the signals to the outside world. Assume factor of 10 overhead for spacing between transistors.) 1000μ Solution: tran die Tran A A 10 1 n     million 23.6 65nm 1000μ 10 1 n 2 2

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Review from Last Time Sophisticated Integrated CAD Toolsets are extensively used in the industry to design integrated circuits Minimize the chances of an error Real asset to (and not a competitor of) the engineer Critical to pay attention to what tools tell you Feature size good metric for characterizing capabilities of a process State of the art at about 65nm Pitch sometimes used instead of feature size Drawn and actual features may differ Bragging rights focus on actual rather than drawn features Yield often determined by statistically independent events Cost of Wafers in \$800 to \$3000 range depending on size and process n P Y 2 / 5 . 2 \$ cm C area unit per
What is meant by “reliably” Yield is acceptable if a very large number of these features are made If P is the probability that a feature is good n is the number of features on an IC Y is the yield n P Y n Y log e e P

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Example: How reliable must a feature be? n=5E3 Y=0.9 5E3 0.9 log n Y e e e e P =0.999979 e e log 0.9 log Y 5E9 n P e e  =0.999999999979 But is n=5000 large enough ?
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EE 330 Lect 3 Spring 2011 - EE 330 Lecture 3 Basic Concepts...

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