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EE 330 Lect 9 Spring 2011

EE 330 Lect 9 Spring 2011 - EE 330 Lecture 9 IC Fabrication...

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EE 330 Lecture 9 IC Fabrication Technology Part 2
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Quiz 8 A 2m silicon crystal is cut into wafers using a wire saw. If the wire diameter is 220um and the wafer thickness is 350um, how many wafers will this 2m crystal provide? In solving this problem you may neglect any wire vibration or abrasive particles used during cutting that would increase the width of the kerf.
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And the number is …. 6 3 1 2 4 5 7 8 9
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And the number is …. 6 3 1 2 4 5 7 8 9 4
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