EE 330 Lect 12 Fall 2011

EE 330 Lect 12 Fall 2011 - EE 330 Lecture 12 Devices in...

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EE 330 Lecture 12 Devices in Semiconductor Processes
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Back-End Process Flow Wafer Probe Die Attach Wafer Dicing Wire Attach (bonding) Package Test Ship Review from Last Time
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Wafer Dicing www.renishaw.com Review from Last Time
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Die Attach 1. Eutectic 2. Pre-form 3. Conductive Epoxy Review from Last Time
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Electrical Connections (Bonding) • Wire Bonding • Bump Bonding Review from Last Time
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Basic Semiconductor Processes MOS (Metal Oxide Semiconductor) 1. NMOS n-ch 2. PMOS p-ch 3. CMOS n-ch & p-ch Basic Device: MOSFET Niche Device: MESFET Other Devices: Diode BJT Resistors Capacitors Schottky Diode
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Basic Semiconductor Processes 1. T 2 L 2. ECL 3. I 2 L 4. Linear ICs Basic Device: BJT (Bipolar Junction Transistor) Niche Devices: HBJT (Heterojunction Bipolar Transistor) HBT Other Devices: Diode Resistor Capacitor Schottky Diode JFET (Junction Field Effect Transistor) Bipolar
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Basic Semiconductor Processes Thin and Thick Film Processes – Basic Device: Resistor BiMOS or BiCMOS – Combines both MOS & Bipolar Processes – Basic Devices: MOSFET & BJT SiGe – BJT with HBT implementation SiGe / MOS – Combines HBT & MOSFET technology SOI / SOS (Silicon on Insulator / Silicon on Sapphire) Twin-Well & Twin Tub CMOS – Very similar to basic CMOS but more optimal transistor char. Other Processes
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Devices in Semiconductor Processes Standard CMOS Process MOS Transistors n-channel p-channel Capacitors Resistors Diodes BJT ( decent in some processes) npn pnp JFET (in some processes) n-channel p-channel Standard Bipolar Process BJT npn pnp JFET n-channel p-channel Diodes Resistors Capacitors Niche Devices Photodetectors (photodiodes, phototransistors, photoresistors) MESFET HBT Schottky Diode (not Shockley) MEM Devices TRIAC/SCR ….
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EE 330 Lect 12 Fall 2011 - EE 330 Lecture 12 Devices in...

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