EE 330 Lect 12 Spring 2011

EE 330 Lect 12 - EE 330 Lecture 12 Devices in Semiconductor Processes Quiz 11 A wire obtained with a ball bond is shown sitting on a bonding pad

Info iconThis preview shows pages 1–12. Sign up to view the full content.

View Full Document Right Arrow Icon
EE 330 Lecture 12 Devices in Semiconductor Processes
Background image of page 1

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Quiz 11 A wire obtained with a ball bond is shown sitting on a bonding pad. What is a typical value for the dimension d1 shown? d 1 =?
Background image of page 2
And the number is …. 6 3 1 2 4 5 7 8 9
Background image of page 3

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
And the number is …. 6 3 1 2 4 5 7 8 9 3
Background image of page 4
Quiz 11 A wire obtained with a ball bond is shown sitting on a bonding pad. What is a typical value for the dimension d1 shown? d 1 =? d 1 =25μ
Background image of page 5

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Back-End Process Flow Wafer Probe Die Attach Wafer Dicing Wire Attach (bonding) Package Test Ship Review from Last Time
Background image of page 6
Wafer Dicing www.renishaw.com Review from Last Time
Background image of page 7

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Die Attach 1. Eutectic 2. Pre-form 3. Conductive Epoxy Review from Last Time
Background image of page 8
Electrical Connections (Bonding) • Wire Bonding • Bump Bonding Review from Last Time
Background image of page 9

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Basic Semiconductor Processes MOS (Metal Oxide Semiconductor) 1. NMOS n-ch 2. PMOS p-ch 3. CMOS n-ch & p-ch Basic Device: MOSFET Niche Device: MESFET Other Devices: Diode BJT Resistors Capacitors Schottky Diode
Background image of page 10
Basic Semiconductor Processes 1. T 2 L 2. ECL 3. I 2 L 4. Linear ICs Basic Device: BJT (Bipolar Junction Transistor) Niche Devices: HBJT (Heterojunction Bipolar Transistor) HBT Other Devices: Diode Resistor Capacitor Schottky Diode JFET (Junction Field Effect Transistor) Bipolar
Background image of page 11

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Image of page 12
This is the end of the preview. Sign up to access the rest of the document.

This document was uploaded on 01/31/2012.

Page1 / 31

EE 330 Lect 12 - EE 330 Lecture 12 Devices in Semiconductor Processes Quiz 11 A wire obtained with a ball bond is shown sitting on a bonding pad

This preview shows document pages 1 - 12. Sign up to view the full document.

View Full Document Right Arrow Icon
Ask a homework question - tutors are online