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Unformatted text preview: = 0.05. What is the Pvalue for this test? (c) Discuss the role of the normality assumption in this problem. Check the assumption of normality for both types of flares. 212 An article in Solid State Technology , "Orthogonal Design of Process Optimization and Its Application to Plasma Etching" by G.Z. Yin and D.W. Jillie (May, 1987) describes an experiment to determine the effect of C2F6 flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing. Data for two flow rates are as follows: (a) Does the C 2 F 6 flow rate affect average etch uniformity? Use = 0.05. (b) What is the Pvalue for the test in part (a)? From the computer printout, P =0.21 (c) Does the C 2 F 6 flow rate affect the wafertowafer variability in etch uniformity? Use = 0.05. (d) Draw box plots to assist in the interpretation of the data from this experiment....
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 Spring '10
 ElShall

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