This preview shows pages 1–2. Sign up to view the full content.
This preview has intentionally blurred sections. Sign up to view the full version.View Full Document
Unformatted text preview: = 0.05. What is the P-value for this test? (c) Discuss the role of the normality assumption in this problem. Check the assumption of normality for both types of flares. 2-12 An article in Solid State Technology , "Orthogonal Design of Process Optimization and Its Application to Plasma Etching" by G.Z. Yin and D.W. Jillie (May, 1987) describes an experiment to determine the effect of C2F6 flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing. Data for two flow rates are as follows: (a) Does the C 2 F 6 flow rate affect average etch uniformity? Use = 0.05. (b) What is the P-value for the test in part (a)? From the computer printout, P =0.21 (c) Does the C 2 F 6 flow rate affect the wafer-to-wafer variability in etch uniformity? Use = 0.05. (d) Draw box plots to assist in the interpretation of the data from this experiment....
View Full Document
- Spring '10