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MSP430_Microcontroller_Basics_Chapter 2

MSP430_Microcontroller_Basics_Chapter 2 - CHAPTER 2 The...

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C H A P T E R 2 The Texas Instruments MSP430 This chapter provides a review of the most important aspects of the hardware of the MSP430. It is a product of Texas Instruments, which I abbreviate to TI. The aim is to cover enough background for Chapter 4, where I tour through some simple programs that demonstrate the main functions. Individual peripherals are covered in detail later, as are some of the more intricate features of the CPU. The general plan follows roughly the layout of the data sheet. I concentrate on the original range of MSP430 devices, which can address 64 KB of memory. The extended MSP430X can address 1 MB but is otherwise similar. I point out the major differences but defer the details until Chapter 11. I take as an example the MSP430F2013, or F2013 for short, which was introduced in 2005. It is one of the smallest MSP430s, with only 14 pins, but nevertheless contains a broad range of functions. It is also the target in TI’s low-cost eZ430–F2013 development tool and its MSP430FG4618/F2013 Experimenter’s Board. The F2003 is identical except for a smaller flash memory and a correspondingly lower price. The notation F20x3 refers to both the F2003 and F2013. It is common to find sets of devices that differ only in their memory; there are four variants of FG4616–FG4619, for instance. The F2003 and F2013 constitute one pair in a related set of devices (F2001, F2002, F2003, F2011, F2012, and F2013), known collectively as F20xx. The pairs differ mainly in their analog inputs. 2.1 The Outside View—Pin-Out The pin-out shows which interior functions are connected to each pin of the package. There are several diagrams for each device, corresponding to the different packages in which it is produced. The F2013 is available in a traditional 14-pin plastic dual-in-line package (PDIP) with pins 0 . 1 apart, which is a boon for hobbyists and students—a device www.newnespress.com
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22 Chapter 2 that is large enough to solder easily by hand. There is also a plastic small-outline thin package (TSSOP). This has a similar shape but is a surface-mount device with pins 0.65 mm (about 0 . 025 ) apart. A general warning: Packages with the same shape do not always have the same pin-out. This does not apply to the F2013, but I have been caught out by other companies’ products. The third option is a tiny, quad flatpack no-lead (QFN) package, which is about 4 mm square with pads 0.65 mm apart. This has 16 leads instead of 14, which allows the analog and digital power connections to be brought out separately for better performance. The pin-out for the PDIP and TSSOP packages is shown in Figure 2.1. Perhaps the most obvious feature is that almost all pins have several functions. This is typical of a modern, small microcontroller. Silicon is cheap but pins are expensive. The aim is therefore to integrate as many functions into as small a package as possible. Most applications do not use all the peripherals so, with luck, there is no conflict where a design needs more than one function on a pin simultaneously. A more detailed list of the functions on each pin is tabulated under Terminal Functions in the data sheet. Here is a sketchy description—the
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