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Unformatted text preview: DS083 December 10, 2003 www.xilinx.com Advance Product Specification 1-800-255-7778 © 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm . All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview DS083-1 (v3.0) December 10, 2003 8 pages • Summary of Features • General Description • Architecture • IP Core and Reference Support • Device/Package Combinations and Maximum I/O • Ordering Information Module 2: Functional Description DS083-2 (v3.0) December 10, 2003 50 pages • Functional Description: RocketIO™ Multi-Gigabit Transceiver • Functional Description: Processor Block • Functional Description: PowerPC™ 405 Core • Functional Description: FPGA-Input/Output Blocks (IOBs)-Digitally Controlled Impedance (DCI)-On-Chip Differential Termination-Configurable Logic Blocks (CLBs)-3-State Buffers-CLB/Slice Configurations-18-Kb Block SelectRAM™ Resources-18-Bit x 18-Bit Multipliers-Global Clock Multiplexer Buffers-Digital Clock Manager (DCM)-Routing-Configuration Module 3: DC and Switching Characteristics DS083-3 (v3.0) December 10, 2003 54 pages • Electrical Characteristics • Performance Characteristics • Switching Characteristics • Pin-to-Pin Output Parameter Guidelines • Pin-to-Pin Input Parameter Guidelines • DCM Timing Parameters Module 4: Pinout Information DS083-4 (v3.0) December 10, 2003 298 pages • Pin Definitions • Pinout Tables-FG256 Wire-Bond Fine-Pitch BGA Package-FG456 Wire-Bond Fine-Pitch BGA Package-FG676 Wire-Bond Fine-Pitch BGA Package-FF672 Flip-Chip Fine-Pitch BGA Package-FF896 Flip-Chip Fine-Pitch BGA Package-FF1148 Flip-Chip Fine-Pitch BGA Package-FF1152 Flip-Chip Fine-Pitch BGA Package-FF1517 Flip-Chip Fine-Pitch BGA Package-FF1696 Flip-Chip Fine-Pitch BGA Package-FF1704 Flip-Chip Fine-Pitch BGA Package IMPORTANT NOTE: The Virtex-II Pro Platform FPGA data sheet is created and published in separate modules. This complete version is provided for easy downloading and searching of the complete document. Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume. Virtex-II Pro™ Platform FPGAs: Complete Data Sheet DS083 December 10, 2003 Advance Product Specification R © 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm ....
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This note was uploaded on 02/08/2012 for the course ECE 412 taught by Professor Chen during the Fall '08 term at University of Illinois, Urbana Champaign.
- Fall '08