chapter1 archecthw

chapter1 archecthw -...

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[10/ 10 Discussion] <1.6> Figure 1.22 gives the relevant chip statistics that influence  the cost of several current chips. In the next few exercises, you will be exploring the  effect of different possible design decisions for the IBM Power5. a. [10] <1.6> What is the yield for the IBM Power5? Die Yield = Wafer Yield [ 1 + (defect * die area) / a ] ^(-a) => for a IBM Power5 = (1 +  (0.3 * 3.89) / 4)^(-4) => 0.359 Niagara => 0.116 Opteron => 0.281 b. [10 Discussion] <1.6> Why does the IBM Power5 have a lower defect rate than the  Niagara and Opteron? The Power5 has a lower defect rate because of the experience level intel has  with the process. - Less Manufacturing defects. [20/20] <1.6> Your colleague at AMD suggests that, since the yield is so poor, you  might make chips cheaper if you placed an extra core on the die and only threw out  chips on which both processors had failed. We will solve this exercise by viewing the  yield as a probability of no defects occurring in a certain area given the defect rate.  Calculate probabilities based on each Opteron core separately (this may not be entirely  accurate, since the yield equation is based on empirical evidence rather than a  mathematical calculation relating the probabilities of finding errors in different portions  of the chip). a. [20] <1.6> What is the probability that a defect will occur on no more than one of the  two processor cores? The chance of having 2 bad cores on one chip is 37.5 or half the rate of defects. So the 
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This note was uploaded on 02/28/2012 for the course CSCE 5610 taught by Professor Staff during the Spring '08 term at North Texas.

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chapter1 archecthw -...

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