HW3 - Text Ch1 - MFET 374 Manufacturing Integration I...

Info iconThis preview shows pages 1–2. Sign up to view the full content.

View Full Document Right Arrow Icon
MFET 374 Homework page 1 of 3 MFET 374 Manufacturing Integration I Homework #3 Spring 2010 Name (Last , First) ________________________________________________________ Read chapter 1 in your text book and then answer the following questions: 1) With respect to data communications there are basically three general types of media. Copper conductors are one type of media. Name two more: ________________________________________________________ ________________________________________________________ 2) Explain the difference between half duplex and full duplex: 3) What does the abbreviation EIA currently stand for? ________________________________________________________ 4) What does the abbreviation EBCDIC stand for? ________________________________________________________ 5) An “octet” is how many bits? ________________________________________________________ 6) What is the IBM 4 of 8 code for the letter “T”? ________________________________________________________ 7) What is the 7-bit ASCII code for the number 7? (please state your answer in hex
Background image of page 1

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Image of page 2
This is the end of the preview. Sign up to access the rest of the document.

This note was uploaded on 02/29/2012 for the course MFET 374 taught by Professor T.e.kostek during the Spring '10 term at Purdue University-West Lafayette.

Page1 / 3

HW3 - Text Ch1 - MFET 374 Manufacturing Integration I...

This preview shows document pages 1 - 2. Sign up to view the full document.

View Full Document Right Arrow Icon
Ask a homework question - tutors are online