lab_report1_fa10

lab_report1_fa10 - Lab Report 1 Table of Contents 1....

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Lab Report 1 Table of Contents 1. 2. Process Procedures (20 points) 3. Calculations (36 Points) 4. Questions (35 Points) 5. Bonus Questions (10 Points) Total Points = 110 possible (graded out of 100) Please be sure to include the requirement signature regarding academic honesty. All lab group members should print out this page, sign on the attached form, and include it with your Lab Report. Thank you! REPORTS MUST BE WORD PROCESSED (EXCEPT FOR SKETCHES AND HAND WRITTEN CALCULATIONS) IF YOU MAKE AN ASSUMPTION, PLEASE STATE IT CLEARLY. PARTIAL CREDIT WILL BE GIVEN EVEN IF THE ANSWER IS NUMERICALLY WRONG. Each group of two students will submit one joint report. The report should be organized as follows: 1. A. Draw cross-sectional profiles of a thin-oxide MOSFET (test structure 8) after each of the 11 major processing steps. Indicate all layers and specify important details such as the non-planar interfaces, isotropic etch profiles, point-source Al evaporation, thermal oxidation growth, etc. Label each feature and indicate thicknesses (make roughly proportional sketches). These drawings should have significantly more detail than those
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question. (5 Points) **Pay attention to details such as consumption of Si during oxidation and isotropic etching profiles and directional metal deposition. B. Draw top views of the same thin-oxide MOSFET (test structure 8) after each of the four photolithography steps. (4 Points) 2. Process Procedures (20 Points) A. List and concisely describe the problems occurred during the fabrication in the class (i.e., nonuniform film deposition, etc.). Specifically, these are the steps where all the wafers were run in batch (i.e. oxidation, poly-deposition, metallization). What were the sources of the problems, and how did you avoid them? Was there any process step during your lab section that deviated from the descriptions in the lab manual? If so, why were some steps done differently and how did it affect the outcome? How do you expect it to affect the performance/function of the device? (7 Points) B. Other than the problems that occurred during the session, what were the particular problems (or deviations from the rest of the groups) that occurred in YOUR wafer? Specifically, these are the steps where all the wafers were run in individual processes (i.e.
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This note was uploaded on 03/03/2012 for the course EECS 142 taught by Professor Ee142 during the Spring '04 term at Berkeley.

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lab_report1_fa10 - Lab Report 1 Table of Contents 1....

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