lab_report2_fa10 - Lab Report 2 Table of Contents 1. 2. 3....

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1 Lab Report 2 Table of Contents 1. Measurements (20 points) 2. Parameter Extraction (25 points) 3. Calculations (33 points) 4. Discussion (15 points) 5. MEMS discussion (7 points) 6. Device Discussion (5 points) [Bonus] TOTAL = 100 points (+ 5 points) This report will summarize characterization of your test structures. The two purposes of characterization are to teach you how to use the equipment and techniques common to semiconductor device analysis, and to compare the actual behavior of your devices with that predicted theoretically. Each group of two (or three) students will submit one joint report. Please follow the outline given in the table of contents above, which will allow the TAs to grade the reports clearly based on the within-section point values described below. Working vs. Non-working devices We understand that some of your devices may not work for a variety of reasons. If this is the case for your group, you are allowed to borrow a wafer from other groups to get functioning device characteristics. However, if your devices do not display precisely the same characteristics as shown in the Device Characterization Outine, do not panic. Keep in mind that the point of this lab report is for you to compare your results to the reference and explore which fabrication steps might have caused that problem. If particular devices do not work in your entire lab section’s wafers, please talk to your TA about the procedure to proceed with the parameter extractions and discussions for this report. Report Submission date Lab report 2 is due by 5pm on Friday, Dec 10, 2010. This is a firm deadline. Please turn in the Cory dropbox or online on bSpace. Removed parts We removed some parts of the characterization to relieve you from being overwhelmed. Please know that your lab report doesn’t have to include the following devices: Capacitors (device #6); transistors (device #12, 13); Circuits (device#15, 16); MEMS (device #17,19, 20,21)
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2 1. Measurements (20 points): The measurements you are responsible for taking and analyzing, are described in the Device Characterization page. They can be split up into 2 groups by the kind of electrical equipment required: Grading for this section: 14 points for 34 plots, 3 points for correct labels and titles and 3 points for device diagrams. 1 . HP4155B: Semiconductor Parameter Analyzer (3 stations): EXPECTED total of 25 PLOTS. Extract the data and make the plots for the: Resistors (1 plot from each of devices #2 a and b) (1points) ( total 2 plots) Contact-Chain Resistors (1 plot from each of devices #2 c and d) (1 point) (total 2 plots) Diode (1 plot-forward (normal) operation only; 1 plot–reverse operation specifically showing the breakdown region and breakdown voltage—from device #7) (1point) (total 2 plots) MOSFETs (2 plots—described at the Device Characterization page—from each of devices #8 a-d, and 2 plots from each of devices#9 a-c, and 2 plot from each of devices #10 and #11) (8.5points) (8 plots + 6 plots + 4 plots = total 18 plots)
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This note was uploaded on 03/03/2012 for the course EECS 142 taught by Professor Ee142 during the Spring '04 term at University of California, Berkeley.

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lab_report2_fa10 - Lab Report 2 Table of Contents 1. 2. 3....

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