MEMS_Process_Flow_s2010 - SPRING 2010 C. Nguyen Week 8b:...

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EE 143 MICROFABRICATION TECHNOLOGY SPRING 2010 C. Nguyen Fabrication Process Flow Week 3: Field oxidation (5000 Å) Week 4: Lithography (Mask I, Active) – define active area (NMOS) and anchor (MEMS) Week 5: Gate oxidation (800 Å) Week 6a: Lithography (Mask V, Release) – open anchor (MEMS) P-substrate NMOS MEMS oxide P-substrate NMOS MEMS oxide P-substrate NMOS MEMS oxide P-substrate NMOS MEMS oxide
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EE 143 MICROFABRICATION TECHNOLOGY SPRING 2010 C. Nguyen Week 6b: Polysilicon deposition (done in Microlab by TA) Week 7a: Lithography (Mask II, Poly) – define poly-Si gate (NMOS) and structures (MEMS) Week 7b: Etch thin oxide – open source-drain area Week 8a: Source-drain (S/D) pre-deposition NMOS MEMS P-substrate oxide poly NMOS MEMS poly oxide P-substrate NMOS MEMS P-substrate oxide poly NMOS MEMS P-substrate poly oxide PSG
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EE 143 MICROFABRICATION TECHNOLOGY
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Unformatted text preview: SPRING 2010 C. Nguyen Week 8b: S/D drive-in Week 8c: Intermediate oxidation (1500 ) Week 9: Lithography (Mask III, Contact) open S/D contact (NMOS) Week 10: Metallization (Aluminum evaporation: 8000 ) NMOS MEMS P-substrate poly oxide n+ n+ NMOS MEMS P-substrate poly oxide n+ n+ NMOS MEMS P-substrate poly oxide n+ n+ NMOS MEMS P-substrate n+ n+ oxide poly Al EE 143 MICROFABRICATION TECHNOLOGY SPRING 2010 C. Nguyen Week 11: Lithography (Mask IV, Metal) define aluminum lines Week 12a: Lithography (Mask V, Release) protect NMOS area Week 12b: Release MEMS comb-drive structures in HF Final cross-section NMOS MEMS P-substrate n+ n+ oxide poly NMOS MEMS P-substrate n+ n+ oxide poly resist NMOS MEMS P-substrate n+ n+ poly resist NMOS MEMS P-substrate n+ n+ poly...
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MEMS_Process_Flow_s2010 - SPRING 2010 C. Nguyen Week 8b:...

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