{[ promptMessage ]}

Bookmark it

{[ promptMessage ]}

midterm2_review - EE143 S06 Review 2 Deposited thickness...

Info iconThis preview shows pages 1–7. Sign up to view the full content.

View Full Document Right Arrow Icon
Professor N Cheung, U.C. Berkeley Review 2 EE143 S06 1 H Evaporation Source Wafer Area=A a Emission flux (cos ) n Deposited thickness not uniform across wafer
Background image of page 1

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full Document Right Arrow Icon
Professor N Cheung, U.C. Berkeley Review 2 EE143 S06 2 Evaporation Sputtering substrate substrate photo resist photo resist deposited film deposited film Step coverage problem is not the same as thickness nonuniformity problem
Background image of page 2
Professor N Cheung, U.C. Berkeley Review 2 EE143 S06 3 Thermal Oxidation Model C G C s C o C i X 0x stagnant layer SiO 2 Si F 1 F 2 F 3 gas transport flux diffusion flux through SiO 2 reaction flux at interface Note C s C o
Background image of page 3

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.