lecture04 - Design and Implementation of VLSI Systems(EN1600 lecture04 Sherief Reda Division of Engineering Brown University Spring 2008[sources

lecture04 - Design and Implementation of VLSI...

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Design and Implementation of VLSI Systems (EN1600) lecture04 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Sedra/Prentice Hall, Saint/McGrawHill, Weste/Addison Wesley]
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Lecture 03: CMOS fabrication
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Fabricating one transistor Oxidation (Field oxide) Silicon substrate Silicon dioxide oxygen Photoresist Develop oxide Photoresist Coating photoresist Mask-Wafer Alignment and Exposure Mask UV light Exposed Photoresist exposed photoresist G S D Active Regions top nitride top nitride S D G silicon nitride Nitride Deposition Contact holes S D G Contact Etch Ion Implantation resist ox ox D G Scanning ion beam S Metal Deposition and Etch drain S D G Metal contacts Polysilicon Deposition polysilicon Silane gas Dopant gas Oxidation (Gate oxide) gate oxide oxygen Photoresist Remove oxide R F P o wer Ionized oxygen gas Oxide Etch photoresist oxide R F Powe r Ionized CF 4 gas Polysilicon Mask and Etch R F P o wer oxide Ionized CCl 4 gas
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  • Spring '12
  • aaa
  • Oxide, SiO2, strip resist, spin resist

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