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Unformatted text preview: Composites in which Solution Asceramics are used as the matrix is related to the slope of the bond-force curve at shown in Equation 2.5–1, Young’s modulus material. Figure 2.5–1 shows that the bond-force curve for x0 .chemical vapor deposition (CVD) material A is steeper than that for material A process by which B (at the point for which F 0). Therefore, material A has a higher Young’s modulus. Since two modulus is a chemically reacted to of the material, we should expect the beam Young’s gases aremeasure of the inherent stiffness produce a thin fabricated from material A to be stiffer and therefore deflect on than an identical of fabricated coating of the reaction product, a solid, less the surface beam from material B. the workpiece. ....................................................................................................................................... close-packed direction A crystallographic direction in aAs discussed previously theatoms touch. is the derivative of the bond-energy crystal along which bond-force curve curve: close-packed plane A crystallographic plane in a 2 crystal on which each atom contacts six neighbors. U U F F and (2.5–2) x x2 x close-packed structures A crystal of a single atom Combining Equations 2.5–1 and 2.5–2 yields are packed as tightly as type in which the spherical atoms 2 possible, giving a coordination number of 12 and an APF U aE (2.5–3) of 0.74.2 HCP and FCC are close-packed structures. x coefficient of of the bond-energy curve at is also proportional to Young’s Thus, the curvaturethermal expansion t h x 0 Term defined modulus. Note that the smaller the radius of curvature, thestates the stiffness. A physical higher that the through the equation t h t h T , which interpretation of this relationship is that the steeper the sides of the energy well, the coefficient of thermal expansion is the atoms away from greater the amount of energy required to displace theconstant that their equilibrium relates positions. thermal strain to changes in te...
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