This preview shows page 1. Sign up to view the full content.
Unformatted text preview: lent bond A type of primary bond formed
chip is bonded to the housing of an electronic p
between two electronegative elements when their average rotatable bonds
conformation The arrangement of the
dielectric constant crystalline materialto st
Ability of a material
2.4.2 Covalent Bonding a molecule.
number of valence electrons is greater than or equal to 4.
and electric ﬁeld. The or
charge when subject to an repeating atomic die
Covalent bonds form in compounds composed of electronegative elements, constant normalized to that of vacuum is the re
creep Time-dependent deformation that occurs at
long-range order is esta
congruent melting The equilibrium melting reaction
those with four or temperatures and low stresses. has a strong tendency to form
more valence electrons. Hydrogen also
relatively high that occurs when solid
dielectric constant. Also called permittivity. T
covalent bonds. Examples of covalentlya bonded phase transforms to a liquid
materials include the elements in
crevice corrosion theA highlygases (H , Cl , F ),of corrosion all carbon-based strength ferromagnetic electric ﬁe
form and essentially
The maximum material
Group IV (C, Ge, phase diatomic identical 2 2
(usually) involving are no concentration gradients the
molecules. Since there oxygen electropositive atoms present,in “extra” electrons re- that a material can withstand without
coordination electronegative limited. be of nearest
quired to ﬁll the valence shell of theelectrolyte is The number obtained by sharing
regions where the ﬂow of the number
diffraction A speciﬁc interaction method
Czochralski of radiation
neighbors that surround an atom or ion.
critical ﬁber length The minimum ﬁber
6 materials. Diffraction appears as reﬂections fro
Consider the Cl atom, with seven electrons in its valence shell (1s 2s 2p 3s 3p ). If
crystal of Si of a predet
core band A to be...
View Full Document