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Unformatted text preview: of their separation
G1 7-27060 / IRWIN / Schaffer
js 1-27-98 plm 3-21-98 ﬁeld is antiparallel to the ext
the internal MP
distance. This force pulls the species closer together if
These materials show a weak response to
they have opposite charge and pushes them apart if they
have charges of the same sign.
Chapter 2 Atomic Scale Structures
die bonding A process by which an in
covalent bond A type of primary bond formed
chip is bonded to the housing of an elect
between twoHelectronegativeHelements H
H H H when their average
dielectric constant Ability of a materi
number of valence electronsCis CgreaterCthan or equal to 4.
charge when subject to an electric ﬁeld.
creep Time-dependent deformation that occurs at
constant normalized to that of vacuum is
rps 01-20-98 rps QC2
relatively high temperatures and low stresses.
dielectric constant. Also called permittiv
crevice corrosion H AH highly Hlocalized form of corrosion
dielectric strength The maximum elec
(usually) involving oxygen concentration gradients in
strength that a material can withstand w
regions where the ﬂow of the electrolyte is limited.
diffraction A speciﬁc interaction of ra
critical ﬁber lengthC CThe Cminimum ﬁber
materials. Diffraction appears as reﬂectio
length-to-diameter ratio forHload to be effectively
planes and is governed by Bragg’s law.
transferred to the strong ﬁbers in a discontinuous ﬁber rps QC2
diffusion bonding A process by which
FIGURE 2.9–1 The structure of polyethylene, PE: (a) the basic building block for PE is the C H monomer; (b) the
composite. system variables suchbeas pressure, the PE polymer
and the external
bonded or joined together by atomic mix
double bond in the monomer is “opened” so that (c) many monomers can
linked together to form
chain; (d) since the polymer chains are saturated,Nucleus of bon...
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