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Unformatted text preview: used both in the ﬁbers as
r window is not. More
possible, giving a coordination band. of 12 a
composition Thisecurve is value the the derivative
endurance limitcase surface or by subjecting amplitude the surface gapa from, theconduction band The
The equivalent process the surface
atoms or ions. of the hardening of A to stress by which to
hibit a high failure strain.
of 0.74. HCP and FCC are close-packed struct
a the bond-energy treatment.
of hardeninge-Text Main Menu | Textbook Table of Contents
in fatigue |below component is will not occur regardless of
which failure hardened by changing the chemical conductivity energy n intrinsic materi
coefﬁcient of thermal expansion located abo
emperature (DBTT) The
ease with the tvalence ba
the number A process in whichseparation distance subjecting the surface to the gap from, which electric
bond lengthof repeated load applications. ﬁlled with
The equilibrium a mold is or by
composition of the surface
T , which
through the equation t h
the fracture surface in a
transported through at hmaterial in state
molten two See or upon can treatment.
between material thations. It heat be estimated from
energy gap atomshardening solidiﬁcation takes the shape coefﬁcient of thermal expansion is the constan
a band gap.
either the bond-energy curve (the point where the energy
of the mold.
to changes in temperatur
casting The change in length ofwhere is ﬁlled with thermal straindescribes the ease with w
A process in which a a specmold
ature corresponding to the
is a minimum) or form of stress-assisted corrosion in which
conductor transported through mett
A material, often a a m
cavitation Amolten materialcurve uponpoint
imen or component divided by the original solidiﬁcation takes the shape
coherent interface An interface separating
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