Keys to Final Exam Spring 2006

Keys to Final Exam Spring 2006 - Keys: IMSE 250 Final Exam...

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Keys: IMSE 250 Final Exam on May 9, 2006 (1-3) More than 90% of today's computer chips are built on silicon wafers because of several reasons. Please judge these statements true or false, in comparison with other semiconductor materials. (1) Silicon is a natural semiconductor. (A) True. (B) False. (2) Silicon is inexpensive and abundant. (A) True. (B) False. (3) Silicon semiconductors give the best IC performances. (A) True. (B) False. (4-8) There are four basic processes in IC manufacturing: deposition, lithography, etching and doping (implantation). (4) Which one of the following processes grows or deposits a thin layer of conductor or insulation material? (A) Deposition (B) Lithography (C) Etching (D) Doping (Implantation) (5) Which one of the following IC manufacturing processes prints mask patterns onto a wafer? (A) Deposition (B) Lithography (C) Etching (D) Doping (Implantation) (6) Which one of the following IC manufacturing processes removes material from selected regions on a wafer (the exposed regions by photoresist)? (A) Deposition (B) Lithography (C) Etching (D) Doping (Implantation) (7) Which one of the following IC manufacturing processes introduces impurity (second element) into semiconductor material to change the conductivity of specific areas on a wafer? (A) Deposition (B) Lithography (C) Etching (D) Doping (Implantation) (8) To make IC chips, ______________ (A) each one of the four processes is used once. (B) most of the four processes are used over and over again. (9) There are two methods (wire-sawing and ID sawing) to slice a silicon ingot into wafers. Which one yields more wafers per unit length of crystal ingot? (A) Wire sawing. (B) ID sawing. (10) Dopants (impurities) are intentionally added into silicon in crucible before crystal pulling. This is to ________ the conductivity of the silicon material. (A) increase (B) decrease (11) With today’s most advanced technology, a single integrated circuit chip can contain about _______ transistors. (A) 50 hundred (B) 50 thousand (C) 50 million (D) 50 billion (12) Fabrication of microchips involves several machining processes. Which one of the following orders is most likely to be correct? (A) Lapping à Ingot grinding (OD grinding) à Wire-sawing à Backgrinding à Dicing à CMP. (B) CMP à Lapping à Backgrinding à Dicing à Ingot grinding (OD grinding) à Wire-sawing. (C) Ingot grinding (OD grinding) à Wire-sawing à Lapping à CMP à Backgrinding à Dicing. (D) Wire-sawing à Ingot grinding (OD grinding) à Lapping à CMP à Backgrinding à Dicing. (13) Silicon wafers are about 750 microns thick. Most semiconductor processes occur in the top _____ of a silicon wafer. (A) 0.5 microns (B) 5 microns (C) 50 microns (D) 500 microns 1
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(14) Resistivity ρ (the relationship between ρ and conductivity C is ρ = 1/C) is an important property of semiconductor silicon.
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This note was uploaded on 04/08/2008 for the course IMSE 250 taught by Professor Pei during the Spring '07 term at Kansas State University.

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Keys to Final Exam Spring 2006 - Keys: IMSE 250 Final Exam...

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