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Unformatted text preview: act heat from
chips in the CPU *Microcooling technology developed
methods *(110) oriented wafer is anisotropically etched.
*Glass plate with fluid supply holes is anodically
bonded over the grooves *Input and output manifolds also etched into the
silicon at the same time as the grooves *Over a 1cm2 area:
* Thermal resistance ≈ 0.1oC/W measured for water flow
rate of 10cm3/s * Power dissipation capability of 600 W/cm2 *For optimal cooling
efficiency: * Fins = 50μm wide x 300μm
height * Equally spaced at 50μm *Dimensions corresponded
closely to typical silicon
wafer thickness *And to typical anisotropically
etched (110) structures
realized in practice *Fabrication of such miniature structures would be
extremely difficult in materials other than silicon *Severe thermal mismatch problems are likely to
be encountered temperature cycling if silicon is
not used as the material for the heat-sink Paper 9, Section V
Applications to Electronic Devices
ME‐119 Two Areas of Application
1. High‐Power Devices 2. Silicon Photovoltaic Converter • Field Controlled Thyristor • V‐groove Multijunction Solar Cells – Switching device with both forward and reverse blocking
– Low forward voltage drop in on‐state – Conversion efficiency between 20‐26% (increase from previous 18% efficiency)
Light (Device contains 52 cathodes, 53 grid fingers) Epitaxial Groove‐Filling Process
• Diffusion cycles last 100+...
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This note was uploaded on 02/03/2014 for the course ME 119 taught by Professor Lwlin during the Spring '08 term at University of California, Berkeley.
- Spring '08
- Mechanical Engineering