12-4-2007 MEMS - 530.352 Materials Selection Lecture #29...

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Page 1 530.352 Materials Selection Lecture #29 Processing MEMS Tuesday Nov. 21 th , 2006
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Page 2 What are MEMS? MICROELECTROMECHANICAL SYSTEMS (MEMS) Small structures, sensors, actuators, machines, and robots Maximum dimensions on the order of millimeters Minimum features on the order of micrometers
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Page 3 What are MEMS?
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Page 4 What are MEMS? Sandia National Laboratory http://www.sandia.gov/mstc/technologies/micro
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Page 6 What are MEMS?
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Page 7 MEMS Technologies: Surface micromachining LPCVD polysilicon used for vast majority of MEMS applications. Thickness limited to 3-5 microns. http://www.memsrus.com/documents/PolyMUMPs.flow.show.pps Bulk micromachining Allows for “thicker” structures DRIE of single crystalline Si wafers is most popular http:// www.memsrus.com/figs/bulk.micro.dcr Electrodeposited (LIGA) Allows for “thicker” metallic structures Ni most popular http://www.memsrus.com/figs/liga.dcr http://mems.engr.wisc.edu/what/ http://www.mdl.sandia.gov /Micromachine/vision.html Klasseen et al., 1995 ~1 μ m J OHNS HOPKINS ENGINEERING
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This note was uploaded on 04/08/2008 for the course MECHENG 352 taught by Professor Hemker during the Spring '08 term at Johns Hopkins.

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12-4-2007 MEMS - 530.352 Materials Selection Lecture #29...

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