Lec_03

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Unformatted text preview: 0000000000 0000000000 00000000000000 p+ n+ n+ 0000000000000000 0000000000 000000000000000000000 0000 0000 0000 0000 00000 00000 00000 00000 p+ p+ Thick field oxide n+ n well p substrate ECEN 475 72.4 Metalization Sputter on aluminum over whole wafer Pattern to remove excess metal, leaving wires 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 000000000000000000 00000000000000000 0000000000000000000000000000 000000000000000000 00000000000000000 0000000000000000000000000000 000000000000000000 00000000000000000 0000000000000000000000000000 000000000000000000 00000000000000000 000000000000000000 0000000000000000000000000000 00000000000000000 000000000000000...
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This document was uploaded on 03/02/2014.

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