Materials single crystalline silicon starting wafer

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Materials: Single-crystalline silicon (starting wafer substrate), silicon dioxide, silicon nitride, polycrystalline silicon, aluminum, tungsten, copper % Key processes: Photo- lithography Pattern Transfer (Etching) Impurity Doping Heat Treatment Layer Deposition
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14 Lecture 1 Overview EEL 5225, Fall 2010, David Arnold How to make MEMS?? % Micromachining % Specialized techniques for fabricating microscale mechanical (or other non-electrical) structures % May not be compatible with standard CMOS processing % Materials: conventional + application-specific % Ex: Lead zirconate titanate (PZT) for piezoelectric applications % Ex: Self-assembled monolayers for chemical sensing % Key processes: Micro- EDM Laser Ablation Polymer Micro- Molding 3D Stereo- lithography Surface Micro- machining Wafer Bonding LIGA/ Electro- plating Bulk Micro- machining
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15 Lecture 1 Overview EEL 5225, Fall 2010, David Arnold How to do MEMS?? Bulk Micromachining Surface Micromachining Source: Source: integrated-mems/index.htm
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