Molded package thickness 120 a overall height 050 bsc

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Molded Package Thickness 1.20 - - A Overall Height 0.50 BSC e Lead Pitch 64 N Number of Leads MAX NOM MIN Dimension Limits MILLIMETERS Units Footprint L1 1.00 REF 2. Chamfers at corners are optional; size may vary. 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side. Notes: Microchip Technology Drawing C04-085C Sheet 2 of 2 L (L1) E c H X X=A—B OR D e/2 DETAIL 1 SECTION A-A T
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dsPIC33EVXXXGM00X/10X FAMILY DS70005144E-page 480 2013-2016 Microchip Technology Inc. RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at Note: Dimension Limits Units C1 Contact Pad Spacing Contact Pad Spacing Contact Pitch C2 MILLIMETERS 0.50 BSC MIN E MAX 11.40 11.40 Contact Pad Length (X28) Contact Pad Width (X28) Y1 X1 1.50 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2085B Sheet 1 of 1 G Distance Between Pads 0.20 NOM 64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP] C2 C1 E G Y1 X1
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2013-2016 Microchip Technology Inc. DS70005144E-page 481 dsPIC33EVXXXGM00X/10X FAMILY B A 0.25 C 0.25 C 0.10 C A B 0.05 C (DATUM B) (DATUM A) C SEATING PLANE NOTE 1 1 2 N 2X TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 1 1 2 N 0.10 C A B 0.10 C A B 0.10 C 0.08 C Microchip Technology Drawing C04-149D [MR] Sheet 1 of 2 2X 64X For the most current package drawings, please see the Microchip Packaging Specification located at Note: 64-Lead Very Thin Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [VQFN] With 7.15 x 7.15 Exposed Pad [Also called QFN] 9.00 9.00 D2 E2 e e 2 64X b K L A (A3) A1
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dsPIC33EVXXXGM00X/10X FAMILY DS70005144E-page 482 2013-2016 Microchip Technology Inc. REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M For the most current package drawings, please see the Microchip Packaging Specification located at Note: 0.50 0.30 0.40 Contact Length L Contact-to-Exposed Pad K - 0.20 - Overall Height Overall Length Exposed Pad Width Contact Thickness Number of Pins Contact Width Exposed Pad Length Overall Width Standoff Pitch E2 D2 b D A3 E A1 7.25 7.05 7.15 9.00 BSC 0.25 7.15 7.05 0.18 7.25 0.30 0.02 9.00 BSC 0.20 REF 0.00 0.05 Dimension Limits e A N Units MAX MIN NOM 0.50 BSC 0.90 64 0.80 1.00 MILLIMETERS Microchip Technology Drawing C04-149D [MR] Sheet 2 of 2 64-Lead Very Thin Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [VQFN] With 7.15 x 7.15 Exposed Pad [Also called QFN]
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2013-2016 Microchip Technology Inc. DS70005144E-page 483
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