70. Outside North America, the location restriction must be in accordance with the international safety standard IEC/EN 60950-1. In the context of these requirements, a restricted access location is further defined as a location: •where access is restricted to only trained personnel •to which unsupervised members of the general public are not admittedControlling equipment environmentThe maximum operational long-term ambient temperature of the system location is 40°C. A temperature above 40°C is permissible (according to ETSI EN 300 019-1-3 V2.1.2 Edition 2003-04 for Environmental Class 3.1: Temperature controlled locations) provided the probability of occurrence is less than 1%. A temperature of 55°C is permissible (according to Telcordia GR-63-CORE, NEBS) but the duration should not exceed 96 continuous hours.
1-18 Observing product and personnel safety guidelines Optical Multiservice Edge 6500 323-1851-545 Standard Rel 1.2 Iss 1 Apr 2005 323-1851-
Module Replacement Procedures 323-1851-545 Standard Rel 1.2 Iss 1 Apr 2005 2-1 Equipment replacement 2- This chapter contains the procedures to replace circuit packs and modules equipped in the Optical Multiservice Edge 6500 (OME6500). Read and understand the following before replacing equipment: • Chapter 1, “ Observing product and personnel safety guidelines ” For circuit pack and module descriptions, refer to Optical Multiservice Edge 6500 Planning Guide, NTRN10BC . 323-1851-545
2-2 Equipment replacement Optical Multiservice Edge 6500 323-1851-545 Standard Rel 1.2 Iss 1 Apr 2005 323-1851- Procedures for equipment replacement Table 2-1 lists the procedures found in this chapter Table 2-1 Module replacement procedures list Action Details Reseating a circuit pack Procedure 2-1 Replacing an optical interface circuit pack Procedure 2-2 Replacing 2xOC-48/STM-16 DWDM plug-in optics (DPO) carrier circuit pack Procedure 2-3 Replacing an OC-48/STM-16 DWDM plug-in optics (DPO) module Procedure 2-4 Replacing the 24xDS3/EC1 circuit pack Procedure 2-5 Replacing a 4xGE circuit pack Procedure 2-6 Replacing a SFP module Procedure 2-7 Replacing a cross-connect circuit pack Procedure 2-8 Replacing the 63xE1 working or protection circuit packs Procedure 2-9 Replacing the DSM 84xDS1 TM circuit pack Procedure 2-10 Replacing the shelf processor Procedure 2-11 Replacing SONET/J-SDH or SDH access panel Procedure 2-12 Replacing a universal breaker interface panel (BIP) Procedure 2-13 Replacing the DS3/EC1 I/O panel Procedure 2-14 Replacing the E1 I/O panel Procedure 2-15 Replacing 120 ohm converter module Procedure 2-16 Replacing I/O protection module Procedure 2-17 Replacing DSM-OAM adapter module Procedure 2-18 Replacing the cooling unit assembly Procedure 2-19 Replacing a cooling unit fan module Procedure 2-20 Replacing a fan module on the DS1 service module Procedure 2-21 Replacing the power input card A or B Procedure 2-22 Replacing the maintenance interface card Procedure 2-23
Equipment replacement 2-3 Module Replacement Procedures 323-1851-545 Standard Rel 1.2 Iss 1 Apr 2005 Replacing the shelf air filter Procedure 2-24 Replacing a circuit pack Procedure 2-25 Reconfiguration of a cross-connect or an optical interface circuit pack Procedure 2-26 Table 2-1 Module replacement procedures list Action Details
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