Following are other methods to reduce power consumption further The Flash

Following are other methods to reduce power

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Following are other methods to reduce power consumption further: The Flash module may be powered down if code is run off SARAM. This results in a current reduction of 35 mA (typical) in the V DD3VFL rail. I DDIO current consumption is reduced by 15 mA (typical) when XCLKOUT is turned off. Significant savings in I DDIO may be realized by disabling the pullups on pins that assume an output function and on XINTF pins. A savings of 35 mW (typical) can be achieved by this. The baseline I DD current (current when the core is executing a dummy loop with no peripherals enabled) is 165 mA, (typical). To arrive at the I DD current for a given application, the current-drawn by the peripherals (enabled by that application) must be added to the baseline I DD current. 120 Electrical Specifications Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28335 TMS320F28334 TMS320F28332 TMS320F28235 TMS320F28234 TMS320F28232
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Current Vs Frequency 0.00 50.00 100.00 150.00 200.00 250.00 300.00 350.00 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 SYSCLKOUT (MHz) Current (mA) IDD IDDIO IDDA18 IDD3VFL 1.8-V Current 3.3-V Current TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 SPRS439H–JUNE 2007–REVISED MARCH 2010 6.4.2 Current Consumption Graphs Figure 6-1. Typical Operational Current Versus Frequency (F28335/F28235/F28334/F28234) Copyright © 2007–2010, Texas Instruments Incorporated Electrical Specifications 121 Submit Documentation Feedback Product Folder Link(s): TMS320F28335 TMS320F28334 TMS320F28332 TMS320F28235 TMS320F28234 TMS320F28232
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Device Power Vs SYSCLKOUT 0.0 100.0 200.0 300.0 400.0 500.0 600.0 700.0 800.0 900.0 1000.0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 SYSCLKOUT (MHz) Device Power (mW) TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 SPRS439H–JUNE 2007–REVISED MARCH 2010 Figure 6-2. Typical Operational Power Versus Frequency (F28335/F28235/F28334/F28234) NOTE Typical operational current for 100-MHz devices (28x32) can be estimated from Figure 6-1 . Compared to 150-MHz devices, the analog and flash module currents remain unchanged. While a marginal decrease in IDDIO current can be expected due to the reduced external activity of peripheral pins, current reduction is primarily in I DD . 6.4.3 Thermal Design Considerations Based on the end application design and operational profile, the I DD and I DDIO currents could vary. Systems with more than 1 Watt power dissipation may require a product level thermal design. Care should be taken to keep T j within specified limits. In the end applications, T case should be measured to estimate the operating junction temperature T j . T case is normally measured at the center of the package top side surface. The thermal application notes IC Package Thermal Metrics (literature number SPRA953 ) and Reliability Data for TMS320LF24xx and TMS320F28xx Devices (literature number SPRA963 ) help to understand the thermal metrics and definitions. 122 Electrical Specifications Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28335 TMS320F28334 TMS320F28332 TMS320F28235 TMS320F28234 TMS320F28232
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EMU0 EMU1 TRST TMS TDI TDO TCK VDDIO DSC EMU0 EMU1 TRST TMS TDI TDO TCK TCK_RET 13 14 2 1 3 7 11 9 6 inches or less PD GND GND GND GND GND 5 4 6 8 10 12 JTAG Header VDDIO TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
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