Fig. 6
SEM cross section of 2.0
l
m thick sputtered columnar AlN on
Pt with Mo on top
Pt
Ti
AlN
(0112)
-
(0112)
-
(0112)
-
(0112)
-
[0001]
[0001]
100 nm
Fig. 7
STEM Z-Contrast image of a vertical slice of AlN cones on
Ti–Pt substrate. The growth direction and the lateral surfaces of the
cones are marked
ii
i
iii
0110
-
111
002
113
-
0002
0111
-
-
0002
0111
-
0110
-
Pt
AlN
ii
i
iii
[2110]
--
-
[2110]
-
[110]
5 nm
Fig. 8
HRTEM micrograph of the Pt/AlN interface with the corre-
sponding FFT. (
i
) Pt along the [110] zone axis, (
ii
)
?
(
iii
) AlN along
the [2–1–10] zone axis
Microsyst Technol (2012) 18:787–795
791
123

3.5 Intrinsic layer stress
The collected experimental results of different sputter
processes versus the applied rf bias power levels demon-
strated that the intrinsic stress in AlN layers could be tuned
over a wide range of about 2 GPa (Fig.
9
). This is in good
agreement with earlier reported results (Lanz et al.
2006
;
Medjani et al.
2006
; Martin and Muralt
2006
; Zhang et al.
2005
). The reason for the intrinsic AlN stress is caused by
energy of the ions impacting on the substrate surface
(Dubois and Muralt
2001
; Lee and Lee
1997
). The film
stress curve of AlN films sputtered at 200
°
C is strongly
shifted compared to curves recorded at 400
°
C.
3.6 Piezoelectric measurements
The effect of the rf bias power level variation on the AlN
material parameter
e
31,f
,
d
33,f
, dielectric permittivity and
FWHM r. c. are summarized in Fig.
10
. Usually three test
samples from a 200 mm wafer were measured. The vertical
bars represent the 1
r
standard deviation.
Figure
10
a shows that the effective transverse coeffi-
cient has no dependency of the rf bias power. This is in
good
agreement
with
earlier
published
results
from
(Karakaya et al.
2008
). The mean transverse coefficients
are between
-
1.0 and
-
1.2 C/m
2
. Maximum values of
-
1.25 C/m
2
were reached and are little less than the best
published results (Lanz et al.
2006
; Muralt et al.
2005
).
Also, for the corresponding effective longitudinal coeffi-
cient no dependency on the applied rf power could be
observed (Fig.
10
b). Dubois and Muralt (
2001
) noticed that
the d
33,
f
is independent from the bias voltage when a
threshold values is exceeded. Therefore we assume that in
all our experiments we are beyond this threshold. Mean
d
33,f
values up to 4.7 pm/V were reached. The maximum
measured
d
33,f
was 5.2 pm/V and is comparable with the
highest published results (Lanz et al.
2006
; Martin et al.
2004
).
As for the piezoelectric coefficients the dielectric per-
mittivity is constant throughout the complete rf bias power
range (Fig.
10
c). In the latter case the values are about 10.5
Fig. 9
Intrinsic stress of AlN films with a thickness of 0.5, 1.0,
2.0
l
m at 400
°
C and for 1.0
l
m at 200
°
C sputtered on Pt as a
function of rf bias power level
(a)
(b)
(c)
(d)
Fig. 10
AlN material parameter
a
|e
31,f
|
,
b
d
33,f
,
c
dielectric permit-
tivity and
d
FWHM r. c. as a function of the rf bias power level
sputtered on Pt at 400
°
C.
Error bars
indicate the 1
r
standard
deviation
792
Microsyst Technol (2012) 18:787–795
123

which is consistent with earlier observations (Lanz et al.


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- Fall '16
- Permittivity, Piezoelectricity, Thin film, AlN