Eel 5225 fall 2010 david arnold repeatability

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EEL 5225, Fall 2010, David Arnold % Repeatability % Agreement between independent measurements made under identical conditions (maximum variation / FSO) % Stability % Ability to maintain response over (usually long) periods of time (maximum variation / FSO) % Overload characteristics % Maximum magnitude of mechanical/thermal/other input that can be applied to the transducer without permanently affecting the response % Cross-axis sensitivity (transverse sensitivity) % Sensitivity of transducer to transverse acceleration or other transverse input (expressed as % FSO) (e.g. accelerometers) % Selectivity % Ability to measure one input (measurand) in the presence of other inputs (e.g. chemical detectors) Transducer Specifications
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14 Lecture 2 Transducer Basics EEL 5225, Fall 2010, David Arnold Transducer Example % Example: pressure sensor % p(t) = pressure, y(t) = voltage Pressure (kPa) Voltage (V) 0 0.09 1 0.22 2 0.35 3 0.46 4 0.55 5 0.66 6 0.7 7 0.8 8 0.89 9 0.91 10 0.93 11 0.94 12 0.94 Offset = NF = n rms = 0.001 V FSO = MDS = p min = Sensitivity = Dynamic Range = Linearity =
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15 Lecture 2 Transducer Basics EEL 5225, Fall 2010, David Arnold Transducer Example % Example: pressure sensor % p(t) = pressure, y(t) = voltage Resonance = Cut-on Freq = Cut-off Freq = Frequency (kHz) Voltage (V) 0 0.49 1 0.5 2 0.45 3 0.48 4 0.51 5 0.53 6 0.6 7 0.8 8 0.7 9 0.4 10 0.2 11 0.1 12 0
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16 Lecture 2 Transducer Basics EEL 5225, Fall 2010, David Arnold MEMS Design Methodology % Top-down design % System : block diagrams, system partitioning, etc. % Device : macromodels, LEM, “blackboxes” % Physical : numerical modeling, finite- element methods, physics % Process : photomasks, layout, microfabrication process modeling % Bottom-up verification System Device Physical Process Simulation Verification Ref. Senturia, Microsystem Design, p. 19.
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17 Lecture 2 Transducer Basics EEL 5225, Fall 2010, David Arnold MEMS Design Strategy % High-Level Design Issues % Market, Impact, Competition, Technology, Manufacturing Ref. Senturia, Microsystem Design, p. 18. Technology-Push vs. Market-pull MEMS can do the “impossible” (e.g. ink jet printer) MEMS can do it better, cheaper, faster, … (e.g. airbag deployment sensors)
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18 Lecture 2 Transducer Basics EEL 5225, Fall 2010, David Arnold
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  • Fall '08
  • Arnold
  • Transducer, DAVID ARNOLD, Transducer Basics

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