TriQuint Semiconductor Inc Phone 1 503 615 9000 FAX 1 503 615 8900 e mail info

Triquint semiconductor inc phone 1 503 615 9000 fax 1

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TriQuint Semiconductor, Inc Phone +1-503-615-9000 FAX: +1-503-615-8900 e-mail: [email protected] Web site: Page 5 of 5 May 2012 AH1-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The AH1- G will be marked with an “A H 1G” designator. An alphanumeric lot code (“XXXX - X”) is also marked below the part designator on the top surface of the package. ESD / MSL Information ESD Rating: Class 1B Value: Passes 500V to <1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class IV Value: Passes 1000V to <2000V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 1 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. AH1G XXXX-X
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