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Columbus, OH: American Society for Nondestructive Testing (1995): p 363-376. 2. . “X-Ray Diffraction and X-Ray Fluorescence.” Nondestructive Testing Handbook , third edition: Vol. 4, Radiographic Testing. Columbus, OH: American Society for Nondestructive Testing (2002): p 427-435. 3. “Electromagnetic Sorting Techniques.” Nondestructive Testing Handbook , second edition: Vol. 4, Electromagnetic Testing. Columbus, OH: American Society for Nondestructive Testing (1986): p 216-249. 4. Hagemaier, D.J. “Eddy Current Impedance Plane Analysis.” Materials Evaluation . Vol. 41, No. 2. Columbus, OH: American Society for Nondestructive Testing (February 1983): p 211-218. 5. Rummel, W.D. “Theory of the Use of Eddy Current Conductivity Devices to Monitor Aluminum Alloys.” Materials Evaluation . Vol. 24, No. 9. Columbus, OH: American Society for Nondestructive Testing (September 1966): p 507-511. 6. Section 42, “Eddy Current Test Indications.” Nondestructive Testing Handbook , first edition: Vol. 2. Columbus, OH: American Society for Nondestructive Testing (1959). 7. Egli, P.H., ed. Thermoelectricity; Including the Proceedings of the Conference on Thermoelectricity, September, 1958. New York, NY: John Wiley and Sons (1960). 8. Von Hippel, A. Dielectric Materials and Applications. Boston, MA: Artech House (1954). 9. Zahn, M. “Optical, Electrical, and Electromechanical Measurement Methodologies of Field, Charge, and Polarization in Dielectrics.” IEEE Transactions on Dielectrics and Electrical Insulation. Vol. 5, No. 5. New York, NY: Institute of Electrical and Electronics Engineers (October 1998): p 627-650. 10. Carr, J.J. Sensors and Circuits. Upper Saddle River, NJ: PTR Prentice Hall (1993). 11. Auld, B.A., A.V. Clark, S.R. Schaps and P.R. Heyliger. “Capacitive Probe Array Measurements and Limitations .” Review of Progress in Quantitative Nondestructive Evaluation [La Jolla, CA, July 1992] . Vol. 12A. New York, NY: Plenum (1993): p 1063-1077. 12. Zahn, M. Electromagnetic Field Theory: A Problem Solving Approach . Malabar, FL: Krieger Publishing (1987). 13. Neelakanta, P.S. Handbook of Electromagnetic Materials. New York, NY: CRC Press (1995). 14. Washabaugh, A.P., A. Mamishev, Y. Du and M. Zahn. “Dielectric Measurements of Semi-Insulating Liquids and Solids.” 12th International Conference on Conduction and Breakdown in Dielectric Liquids [Rome, Italy, July 1996]. New York, NY: Institute of Electrical and Electronics Engineers (1996): p 381-384. 15. Sheppard, N.F., Jr., D.R. Day, H.L. Lee and S.D. Senturia. “Microdielectrometry.” Sensors and Actuators. Vol. 2. Lausanne, Switzerland: Elsevier Sequoia (1982): p 263-274. 16. Senturia, S.D., N.F. Sheppard, Jr., H.L. Lee and D.R. Day. “In-Situ Measurement of the Properties of Curing Systems with Microdielectrometry.” Journal of Adhesion. Vol. 15. Langhorne, PA: Gordon and Breach (1982): p 69-90. 17. Zaretsky, M.C., L. Mouayad and J.R. Melcher. “Continuum Properties from Interdigital Electrode Dielectrometry.” IEEE Transactions on Electrical Insulation . Vol. 23, No. 6.
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  • Fall '19
  • Magnetism, Magnetic Field, Electrical conductivity

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