This command checks the boundary cell placement for the following issues

This command checks the boundary cell placement for

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This command checks the boundary cell placement for the following issues: Missing boundary or corner cells This check verifies that there are boundary and corner cells around the entire boundary, with no gaps. Figure 6-3 shows a valid placement, as well as errors caused by missing cells. Figure 6-3 Check for Missing Boundary or Corner Cells Note: For established nodes, boundary cells are inserted only on the left and right sides. In this case, the command verifies only that there are no gaps on these sides.
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Chapter 6: Chip Finishing and Design for Manufacturing Finding and Fixing Antenna Violations 6-10 IC Compiler™ II Implementation User Guide L-2016.03-SP4 IC Compiler™ II Implementation User Guide Version L-2016.03-SP4 Incorrect boundary or corner cells This check verifies that the library cells used for the boundary and corner cells match the cells specified by the set_boundary_cell_rules command. Incorrect orientation of boundary cells This check verifies that the orientation of each boundary cell matches the allowed orientations specified by the set_boundary_cell_rules command. Short rows and edges This check verifies that each row of boundary cells is wider than the value specified by the set_boundary_cell_rules -min_row_width option and that the horizontal edges of each blockage are greater than the value specified by the set_boundary_cell_rules -min_horizontal_jog option. Finding and Fixing Antenna Violations In chip manufacturing, gate oxide can be easily damaged by electrostatic discharge. The static charge that is collected on wires during the multilevel metalization process can damage the device or lead to a total chip failure. The phenomenon of an electrostatic charge being discharged into the device is referred to as either antenna or charge-collecting antenna problems. To prevent antenna problems, the tool verifies that for each input pin the metal antenna area divided by the gate area is less than the maximum antenna ratio given by the foundry: (antenna-area)/(gate-area) < (max-antenna-ratio) The antenna flow consists of the following steps: 1.Define the antenna rules. 2. Specify the antenna properties of the pins and ports. 3. Analyze and fix the antenna violations. Defining Metal Layer Antenna Rules You define the metal layer antenna rules by defining both global metal layer antenna rules and layer-specific metal layer antenna rules. To define global metal layer antenna rules, use the define_antenna_rule command. To define layer-specific antenna rules, use the define_antenna_layer_rule command.
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Chapter 6: Chip Finishing and Design for Manufacturing Finding and Fixing Antenna Violations 6-11 IC Compiler™ II Implementation User Guide Version L-2016.03-SP4 The following commands show an example of defining the metal layer antenna rules for the M1 and M2 metal layers and the VIA1 via layer: set lib [current_lib] define_antenna_rule $lib -mode 1 -diode_mode 4 \ -metal_ratio 300 -cut_ratio 20 define_antenna_layer_rule $lib -mode 1 -layer "M1" \ -ratio 300 -diode_ratio {0.09 0 123 16880}
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