Group Assignment 3
Team 12
% section 2 at a
clear all,clc
sig1=4.19;
sig2=0;
sig3=-4.19;
sut=42;
suc=140;
c1=.5.*[abs(sig1-sig2)+(sig1+sig2).*(2.*sut-abs(suc)/abs(suc)]
c2=.5.*[abs(sig2-sig3)+(sig2+si
ME 466 Spring 2017
I.
Project 2
Due: 04/07
Design a shaft, flywheel, journal bearings and roller bearings using the following specifications.
A. Specifications
a. The shaft has a diameter d.
b. The in
clear all
close all
clc
D=1.215; %Coil diameter in
d=.135; %wire diameter in
Nt=10; %total coils
G=11.5; %modulus of rigidity Mpsi
Fl=60; 0inal load lbs
allowance=15; %allowance for clash
C=D/d
Sut=18
ME 466
Design II Bearing Design
11/14/08
For this design, we were asked to design bearings for the shaft designed in Design 1. The
dimensions of the bearing, clearances, and lubricating fluid were fou
This design project involves the design of a shaft and flywheel to meet the pre-specified
design criteria. Our design criteria was a safety factor > 1.75 and a shaft life > 1.0X107.
The most important
ME 466
Design Project 1
Due: 4/4/08
This design project involves the design of a shaft and flywheel to meet the pre-specified
design criteria. Our design criteria was a safety factor > 2.00 and a shaf
Design Project 3
Helical Compression Spring
ME 466
11/21/08
For Design Project 3 we were asked to design a helical compression spring to meet the given
requirements. There was a 200 N force at 25mm de
ME 466
Design 2
Objective
The objective of this design project was to find a journal and ball bearing that would
support the shaft we designed in project one. For the journal bearing we had to choose
Design Project 1
ME 466
Objective:
In this project we were given the task of finding a diameter of a shaft with a flywheel attached
to it. We were given the Tresca safety factor and were told that the
ME 466
Design Project 2
Due: 4/11/08
Specifications:
Journal bearings must be designed to support the shaft in the previous handout.
For the journal bearing, dimensions, clearances, and lubricating fl
HW#2
3.13 (Plane composite wall) Use the thermal circuit analysis. Thermal conductivities of materials are in Table A.3 in
Appendix. You can use properties at 300 K. Here, contact resistance is ignore