Problems set #2 (MSE 311)
1. We want to use thermal evaporation to deposit a gold layer on top of the structures shown below. If the formed
thickness on the flat surface is 100 nm, calculate the film thickness on the labeled surfaces (i.e. A, B, and C) fo

MSE 311: Introduction to MEMS
Lecture 17:
Piezoelectric transduction (Chapter 10)
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Piezoelectricity
Discovered by Curie brothers (1880-81), piezoelectricity is the

MSE 311: Introduction to MEMS
Lecture 18:
Thermal transduction (Chapter 11)
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Modes of heat transfer
There are three heat exchange
mechanisms between a structure and

MSE 311: Introduction to MEMS
Lecture 7:
Other Additive Techniques
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Sputtering
The surface of the target is bombarded with a flow of positively charged
ions that kn

MSE 311: Introduction to MEMS
Lecture 16:
Capacitive transduction (Chapter 9)
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Non-MEMS Capacitors
MSE 311/711: Introduction to MEMS
2
Capacitor fundamentals
Paralle

MSE 311: Introduction to MEMS
Lecture 5:
Thermal oxidation
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Adding layers to surface
A common processing step in
microfabrication is addition of
layers of materials

MSE 311: Introduction to MEMS
Lecture 3:
Electrical properties of silicon and doping
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Electrical properties of silicon
Electrically, the materials are grouped under

MSE 311: Introduction to MEMS
Lecture 8:
Photolithography
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Microfabrication process
Starting substrate
(e.g., silicon wafer)
Thin film formation
(e.g., oxidation, PV

MSE 311: Introduction to MEMS
Lecture 15:
Piezoresistive transduction
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Modelling of MEMS
1.
Establish context
2.
Parameters
Constraints
Accuracy
Design a proper mode

MSE 311: Introduction to MEMS
Lecture 14:
MEMS transducers & Dynamics for MEMS
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Bending of beams and plates
Beams are essentially considered as 1D elements
when ana

MSE 311: Introduction to MEMS
Lecture 12:
Solid Mechanics
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Stress
Stress: the force per unit area acting on the surface of a differential
volume element of a solid b

MSE 311: Introduction to MEMS
Lecture 4:
Doping (Ion implantation)
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Doping through implantation
Fundamentals of semiconductor fabrication
by G. May and S. Sze, Wiley

Simon Fraser University
Mechatronic Systems Engineering
Final Exam for
ENSC 331/895: Introduction to MEMS
Instructor: Behraad Bahreyni
15 August 2011
Time: 150 minutes
Name:_
Student number:_
To verify identity, each candidate should be prepared to produc

Quiz #2-A
Time: 35 minutes
MSE 311/711, Summer 2016
Name: _
Student ID: _
*PROVIDE THREE DIGITS OF ACCURACCY FOR ALL OF YOUR ANSWERS*
Question 1 (a): A bare (111) silicon wafer was put inside a thermal furnace for dry oxidation for 2 hours at
1000 C. What

Problems set #3 (MSE 311)
Question 1.
Serial
1
Process
PECVD Nitride (low operation
temperature and lower chances of
cracking deposited layer)
2
Lithography (spin PR, exposure,
development)
3
Dry/wet etching of Nitride (remove
unwanted nitride to make str

Quiz #1-A
MSE 311/711, Summer 2016
Name: _
Student ID: _
*PROVIDE THREE DIGITS OF ACCURACCY FOR ALL OF YOUR ANSWERS*
Question 1: Draw the [100], [010], [110], and [111] directions on a simple cubic lattice of unity spacing (a=1).
(4 points)
Question 2: We

Paper no: _
Simon Fraser University
Mechatronic Systems Engineering
Final Exam for
ENSC 331: Introduction to MEMS
Instructor: Behraad Bahreyni
9 August 2012
Time: 150 minutes
Name: _
Student number: _
To verify identity, each candidate should be prepared

Problem set #6
MSE 311
Summer 2016
1. A chevron thermal actuator is shown to the
right. Each of the beams has a 2 2
cross section and is = 100 long. The
total electrical resistance of the beams is
10 and the thermal conductivity of the
structural material

Problem set #5
MSE 311
Summer 2016
1. Schematic of a surface micromachined accelerometer is shown in below. The device is made from
a 2 thick layer of polysilicon. The rigid proof mass of the accelerometer is 1000 1000
and is connected to the substrate vi

MSE 311: Introduction to MEMS
Lecture 4:
Doping (Ion implantation)
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Doping through implantation
Fundamentals of semiconductor fabrication
by G. May and S. Sze, Wiley

Problem set #3
MSE 311
Summer 2016
1. Propose a process flow to fabricate the silicon nitride
cantilever shown here (250nm thick). Choose only from the
following processes. Justify your selection for each step in
less than one full line of text:
PECVD
APC

Quiz #4-A
Time: 35 minutes
MSE 311, Summer 2016
Name: _
Student ID: _
1- Consider the top view of a MEMS beam spring that is composed of
two similar beams. The length and width of both beams are and ,
respectively. The beams are connected to each other th

Simon Fraser University
Mechatronic Systems Engineering
Midterm Exam for
ENSC 331: Introduction to MEMS
Instructor: Behraad Bahreyni
4 July 2012
Time: 90 minutes
Name: _
Student number: _
To verify identity, each candidate should be prepared to produce,
u

Problems set #1 (MSE 311)
1. If a plane has intercepts at 2a, -3a, and 4a along the three Cartesian coordinates, where a is the lattice
constant, find the Miller indices of the plane.
2. The background concentration of phosphorous in a silicon wafer is 5

MSE 311: Introduction to MEMS
Lecture 6:
Physical Vapor Deposition
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
Physical Vapor Deposition
It is usually not possible to grow the required thin film
from the sub

MSE 311: Introduction to MEMS
Lecture 13:
Beams in MEMS (Sec 10.3)
Instructor: Amin Rasouli
School of Mechatronic Systems Engineering
Simon Fraser University
The mighty cantilever
We do not have gears or various linkages hinges that
are used in larger sc

Quiz #3-A MSE 311/711, Summer 2016
Time: 30 minutes
Name: Student ID:
*PROVIDE THREE DIGITS OF ACCURACCY FOR ALL OF YOUR ANSWERS*
Question 1 (a): We would like to etch 40 um deep grooves on a (100) wafer (cross section as shown below).
The grooves are etc

Simon Fraser University
Mechatronic Systems Engineering
Midterm Exam for
ENVSC 3’3 1/ 895: Introduction to MEMS
Instructor: Behraad Bahreyni
27 June 2011
Time: 100 minutes
Name: go: in f: an”:
Student number:
To verify identity, each candidate should be p

Paper no: i
L-._._._-_.:
Simon Fraser University
Mechatronic Systems Engineering
Final Exam for
ENSC 331: Introduction to MEMS
Instructor: Behraad Bahreyni
9 Au net 2012
Time: 150 minutes
Name: _ I} I. r} '
Student number:
To verify identity, each candida