PROBLEM 6.1 KNOWN: Variation of hx with x for laminar flow over a flat plate. FIND: Ratio of average coefficient, h x , to local coefficient, hx, at x. SCHEMATIC:
ANALYSIS: The average value of hx between 0 and x is hx = hx hx Hence, 1 x C x h x dx
PROBLEM 11.1
KNOWN: Initial overall heat transfer coefficient of a firetube boiler. Fouling factors following one year's application. FIND: Whether cleaning should be scheduled. SCHEMATIC:
ASSUMPTIONS: (1) Negligible tube wall conduction resistance
PROBLEM 12.1
KNOWN: Rate at which radiation is intercepted by each of three surfaces (see (Example 12.1). FIND: Irradiation, G[W/m ], at each of the three surfaces. SCHEMATIC:
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PROBLEM 13.1
KNOWN: Various geometric shapes involving two areas A1 and A2. FIND: Shape factors, F12 and F21, for each configuration. ASSUMPTIONS: Surfaces are diffuse. ANALYSIS: The analysis is not to make use of tables or charts. The approach invol
PROBLEM 5.1 KNOWN: Electrical heater attached to backside of plate while front surface is exposed to convection process (T,h); initially plate is at a uniform temperature of the ambient air and suddenly heater power is switched on providing a constan
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PROBLEM 3.1 KNOWN: Onedimensional, plane wall separating hot and cold fluids at T,1 and T ,2 , respectively. FIND: Temperature distribution, T(x), and heat flux, q , in terms of T,1 , T,2 , h1 , h 2 , k x and L. SCHEMATIC:
ASSUMPTIONS: (1) Onedim
Problem 1 (15%)
For the 2D geometry shown below sketch the heat flux plot showing and labeling the adiabats and
isotherms and any conditions they must meet in the interior and on the boundaries, At least five lines of
each should be presented and spaced t
PROBLEEVI 1 g25% \
A plate (k: 0 20 meK) has a thickness L' Camvectiun heat transfer occurs on the left hand side
to air at amperature of 500W; wuh a couveclion coefcient onS me1K The. right side (a
0 4) 13 Bxpcsed to a vacuum chambler Whose walls (E: 0
PROBLEM 6.7
KNOWN: Distribution of local convection coefficient for obstructed parallel flow over a flat
plate.
FIND: Average heat transfer coefficient and ratio of average to local at the trailing edge.
SCHEMATIC:
ANALYSIS: The average convection coeffic
PROBLEM 1.27
KNOWN: Upper temperature set point, Tset, of a bimetallic switch and convection heat
transfer coefficient between clothes dryer air and exposed surface of switch.
FIND: Electrical power for heater to maintain Tset when air temperature is T =
PROBLEM 2.11
KNOWN: Onedimensional system with prescribed thermal conductivity and thickness.
FIND: Unknowns for various temperature conditions and sketch distribution.
SCHEMATIC:
ASSUMPTIONS: (1) Steadystate conditions, (2) Onedimensional conduction,
PROBLEM 3.6
KNOWN: Curing of a transparent film by radiant heating with substrate and film surface subjected to
known thermal conditions.
FIND: (a) Thermal circuit for this situation, (b) Radiant heat flux, q (W/m2), to maintain bond at
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PROBLEM 3.51
KNOWN: Pipe wall temperature and convection conditions associated with water flow through the pipe and ice layer formation on the inner surface. FIND: Ice layer thickness . SCHEMATIC:
ASSUMPTIONS: (1) Onedimensional, steadystate condu
PROBLEM 3.101
KNOWN: Dimensions of a plate insulated on its bottom and thermally joined to heat sinks at its ends. Net heat flux at top surface. FIND: (a) Differential equation which determines temperature distribution in plate, (b) Temperature distr
PROBLEM 14.1
KNOWN: Mixture of O2 and N2 with partial pressures in the ratio 0.21 to 0.79. FIND: Mass fraction of each species in the mixture. SCHEMATIC:
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MO M
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= 32 kg/kmol
N2 = 28 kg/kmol
ASSUMPTIONS: (1) Perfect gas beh
PROBLEM 2.1
KNOWN: Steadystate, onedimensional heat conduction through an axisymmetric shape. FIND: Sketch temperature distribution and explain shape of curve. SCHEMATIC:
ASSUMPTIONS: (1) Steadystate, onedimensional conduction, (2) Constant prop
PROBLEM 1.1 KNOWN: Heat rate, q, through onedimensional wall of area A, thickness L, thermal
conductivity k and inner temperature, T1. FIND: The outer temperature of the wall, T2. SCHEMATIC:
ASSUMPTIONS: (1) Onedimensional conduction in the xdire
PROBLEM 1.41
KNOWN: Hot platetype wafer thermal processing tool based upon heat transfer modes by conduction through gas within the gap and by radiation exchange across gap. FIND: (a) Radiative and conduction heat fluxes across gap for specified hot
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PROBLEM 4.39
KNOWN: Plane surface of twodimensional system.
FIND: The finitedifference equation for nodal point on this boundary when (a) insulated; compare
result with Eq. 4.42, and when (b) subjected to a constant heat flux.
SCHEMATIC:
ASSUMPTIONS: (1